Principal Packaging Engineer
Posting Start Date: 3/23/26
Job Location(s): San Jose
Requisition ID: 77070
Job Description:
Description- We are seeking a Principal Packaging Engineer with expertice in advanced laminate packaging technologies to support new product development (NPI) of RF System in Package (SiP) modules. Candidate will be the RF packaging interface between multi-functional groups within Skyworks and internal/external manufacturing.
- This position offers significant opportunities for growth, including leading strategic packaging initiatives and influencing Skyworks packaging technology roadmap. Leadership experience, either as a program manager, people manager, or technical lead is a strong plus.
- On-site location is flexiable. Desired location in San Jose CA or Irvine CA.
Responsibilities- Working with IC design teams to define and implement the package requirements.
- Ownership of specific product from feasibility stage to high volume production.
- Ensuring that DFM/BKM is implemented for assembly yield, cost, and reliability.
- Developing new assembly technologies, running process DOE's, identifying new materials and equipment, reliability testing, and qualification of new assembly process.
Required Experience and Skills- BS Degree in either Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science.
- Minimum 12 years experience (or MS and 8 years) in semiconductor packaging technology
- Strong project management and communication skills (verbal, written, and presentation).
- Expertise with overmolded laminate module packaging processes: SMT, Wirebonding, Die Attach, and Molding.
- Knowledge of various assembly processes: Flip Chip Bumping, Fan Out, WLCSP, BGA, Module Level Shielding, and IPDs.
- Experience in Advanced RF SiP Moldules: Dual Side BGA, Dual Side Mold Grid Array, EMI Shielding,
- Experience working with OSAT Assembly Factories in Asia.
Desired Experience and Skills- Solid understanding of Design Rules Check and Design for Manufacturing
- Hands on experience with assembly process/equipment.
- Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
- Understanding of RF products and concepts is highly desired.
- Experience with Failure Analysis.
- Understanding of Module and Board Level Reliability requirements.
- Understanding of manufacturing of organic laminate technologies.
- Experience with Lead-Frame Packaging.
- Prior R&D experience of advanced packaging concepts.
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The typical base pay range for this role across the U.S. is currently USD $129,400 - $247,800 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.
