Locations available: San Diego and San Jose, California or Austin, Texas

Job Description:

NXP’s SerDes Networking Solution (SNS) team delivers open-standard Automotive SerDes Alliance (ASA) Motion Link multi-Gigabit connectivity for next-generation sensors and vehicle displays. As part of the Applications Engineering team, you will work with both internal engineering teams to develop collaterals to ease customer adoption of our SerDes solutions, as well as with NXP’s field teams and customer engineering teams to ensure successful system design and bring-up.

Key Responsibilities:

• Collaborate with IC design, systems, FW, and test teams to translate field issues and customer requirements into product improvements and new features.
• Review customer schematics and layouts for signalintegrity and powerintegrity best practices (impedance control, terminations, return paths, via design, reference plane strategy).
• Lead boardlevel bringup and validation using oscilloscopes, protocol analyzers; generate test reports and recommendations.
• Provide onsite or remote debug support for complex customer issues.
• Develop and maintain application collateral: reference designs, layout guidelines, design checklists, characterization reports, application notes, training materials.
• Participate in trade shows and provide FAE training

Qualifications:

• Bachelor’s degree or above in Electrical/Electronic Engineering or related field.
• Extensive experience (12+ years) in hardware design, applications engineering, or system validation.
• Familiarity with high-speed data communication protocols and interfaces, including Ethernet networking and switching, MIPI CSI-2, and display protocols (DP/eDP)
• Strong understanding of highspeed SerDes fundamentals: channel loss, reflections, return loss, insertion loss, ISI, jitter, equalization, and clocking.
• Demonstrated experience with multiGbps serial links (e.g., Ethernet, PCIe, DP, USB3.x/USB4, proprietary SerDes).
• Proficiency with SI/PI tools and simulations (e.g., Sparameter analysis, eye/jitter simulations) and comfort interpreting simulation and measurement correlation.
• Handson experience using lab equipment: highbandwidth oscilloscopes, TDR, VNA, BERT, protocol analyzers, logic analyzers, and related tools.
• Strong skills in PCB design for highspeed: layer stackup, routing constraints, differential pairs, reference planes, decoupling, and power delivery.
• Excellent communication and presentation skills to explain complex technical topics to both expert and nonexpert audiences. 5
• Ability to work effectively with global, crossfunctional teams (design, systems, test, marketing, field).