Director, Hardware EngineeringThe OpportunityWe are seeking a Director of Hardware Engineering to lead our silicon development organization. You will oversee the entire hardware lifecycle, from initial architecture and RTL design to physical implementation, DFT, and post-silicon bring-up.
What You'll Do- Strategic Silicon Roadmap: Own the hardware execution strategy. Make critical decisions on process node selection, third-party IP integration, and package design.
- Team Scaling & Mentorship: Recruit and lead a world class team.
- Hardware-Software Relationship: Partner with the Director of Software to ensure the hardware architecture is optimized for modern HPC workloads and compiler efficiency.
- Execution Excellence: Drive the methodology for multi-site design synchronization, ensuring top-tier verification coverage and first-pass silicon success.
- Vendor & Foundry Management: Manage high-level relationships with foundries, EDA vendors, and IP providers to ensure favorable terms and support.
- Post-Silicon Leadership: Oversee the transition from GDSII to silicon bring-up, working with yield and test engineering to drive high-volume manufacturing readiness.
What You Bring- Experience: 15+ years in semiconductor engineering, with 8+ years in leadership roles managing complex SoC or CPU projects.
- Advanced Node Expertise: Proven track record leading development cycles for bleeding-edge silicon, specifically at 5nm or below technology nodes.
- Education: A Bachelor's or Master's in Electrical Engineering or Computer Engineering. A PhD is a plus.
- Technical Mastery: Deep expertise in the full Netlist-to-GDSII flow, including high-speed interconnects, memory hierarchies, and power delivery.
- Tape-out Track Record: Proven history of leading multiple successful tape-outs on advanced FinFET nodes.
- Business Acumen: Ability to balance technical perfection with time-to-market pressures and budgetary constraints.
- Influence: A strong reputation in the silicon industry with the ability to attract top-tier talent and negotiate with global partners.
Bonus Points- Experience with large-scale mesh interconnects or many-core architectures.
- Background in advanced packaging (2.5D/3D IC, Chiplets).
- Direct experience with RISC-V ISA implementation at scale.
If you are a seasoned hardware leader ready to steer the development of the next generation of supercomputing silicon, we'd love to hear from you.
