Job Details:

Job Description:

Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division driving the next generation of semiconductor packaging solutions. The team focuses on groundbreaking technologies that extend beyond traditional methods to enable the future of high-performance computing.

Primary Focus:
• Advanced semiconductor packaging technologies beyond conventional approaches
• 3D packaging innovations and chiplet integration
• High-performance computing packaging for data centers and AI applications
• Heterogeneous integration across diverse chip technologies
• Scaling packaging density while enhancing thermal and electrical performance

Key Objectives:
• Advance Moore's Law through cutting-edge packaging technologies
• Reduce system-level power consumption while improving overall performance
• Support Intel's IDM 2.0 strategy and Intel Foundry Services
• Develop packaging solutions tailored to emerging workloads such as AI and edge computing

Test Module Development Engineer responsibilities include but are not limited to:
• Executes test technology development and enablement for high-mix, low-volume testing and future technologies, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
• Implements design and development of technically sophisticated test processes and/or repair reverse engineering, including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
• Executes pathfinding and development activities in support of the Intel Foundry advanced packaging roadmap.
• Implements modifications for test equipment/collateral to improve efficiency, manufacturing techniques, and optimize production output for existing products.
• Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.
• Executes technology feasibility studies through theoretical simulations and/or practical engineering methods.
• Remains updated on relevant industrial process and materials manufacturing trends and develops a perspective on the Intel Foundry Advanced Packaging roadmap to drive industry leadership by collaborating with vendor ecosystems for cost-effective solutions.

Behavioral traits:
• Excellent verbal and written communication skills.
• Initiative, self-motivated and ability to work independently.

This position requires regular onsite presence.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:
• Bachelor's degree in engineering, physics, chemistry or related STEM field with 6+ years of experience.

OR
• Master's degree in engineering, physics, chemistry or related STEM field with 4+ years of experience.

OR
• Ph.D. degree in engineering, physics, chemistry or related field.
• The experience outlined above should reflect a combination of the following competencies:

- Electrical test-related experience
- Application of statistical controls
- FMEA and/or DOE methodologies

Preferred Qualifications:
• Prior related work experience with semiconductor package design, test software, and/or test equipment/collateral/fixture development.
• Product ownership, change control management and data systems
• Project management and delivering results for time-critical technical projects.
• Technical innovation and deliver results for complex, time-critical technical projects.

Job Type:
Experienced Hire

Shift:
Shift 1 (United States of America)

Primary Location:
US, Arizona, Phoenix

Additional Locations:

Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.