As a member of Solution engineering, you will be joining a team developing end2end sign-off methodology for system timing/power/thermal/test/yield, implementation, post-silicon characterization and tuning for highly complex industry leading compute and multi-die SoCs. The position requires delivering solution and automation for accurate analysis and co-optimization across all sign-off domains including RC, STA, PDN, Power, yield for system convergence. The position also gives opportunity for leading product level implementation and sign-off. Outstanding expertise in EDA tool-flows and delivery of large scale automation is required for meticulous optimization of power-perf trade-off. The role also brings opportunity to collaborate with foundry, EDA and ecosystem partners in 3nm/2nm technodes and multi-die.

Responsibilities:
• Develop multi-die sign-off flow and automation for best-in-class Fmax and Power/GHz
• Develop PVT, Vdrop and thermal aware methodology and flows enabling custom techniques in multi-voltage design, advanced clocking, critical path analysis and silicon variation.
• Infuse innovative industry tools and internal developed statistical, analytical algorithms and machine learning methodologies to develop and refine STA and IR-PDN-Thermal bottlenecks.
• The suitable candidate will be able to analyze the requirements, define and develop CAD solution including external EDA tools integration.
• Ability to lead a product implementation and sign-off, working closely with internal design teams, foundry and partners.

Required Skills and Experience :
• Strong expertise with end2end silicon convergence with IP char, EDA algorithms, RC, STA and PDN analysis for both on-chip and package.
• Hands-on experience developing large scale automation for co-optimization of PPA and sign-off.
• Hands-on experience with analyzing data for measurable contributions to sign-off methodology and workflows.
• Strong coding proficiency in languages Python, C, Tcl.
• Proficiency with version control systems like git, distributed processing, and disk management.
• Ability to work with evolving problem statements and solutions. Excellent interpersonal skills, communication, team spirit and effective collaboration with multi-functional teams.

"Nice To Have" Skills and Experience :

Experience with multi-die SoC design flows, IR and STA convergence and subject areas SoC interfaces, budgeting, constraints, UPF

In Return:

We are proud to have a set of behaviors that reflect our culture and guide our decisions, defining how we work together to defy ordinary and shape outstanding!

• Partner and customer focus
• Teamwork and communication
• Creativity and innovation
• Team and personal development
• Impact and influence
• Deliver on your promises

Our 10x mindset guides how we engineer, collaborate, and grow. Understand what it means and how to reflect 10x in your work: https://careers.arm.com/en/10x-mindset

Salary Range:

$198,100-$268,000 per year
We value people as individuals and our dedication is to reward people competitively and equitably for the work they do and the skills and experience they bring to Arm. Salary is only one component of Arm's offering. The total reward package will be shared with candidates during the recruitment and selection process.

Hybrid Working at Arm

Arm's approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups/teams to determine their own hybrid working patterns, depending on the work and the team's needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.