Micron Technology

Sr Thermal Simulation Engineer, HBM

Micron Technology • $100K — $130K *
Richardson, TX 75080In-Person
Technical Services
Less than 5 years of experience
Today
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Job Overview by Ladders

Qualifications

  • MS + 3 years experience or PhD in relevant field (Mechanical Engineering, Materials Science, Physics)
  • Experience in thermal simulation or multiphysics modeling within semiconductor or advanced packaging domains
  • Strong foundation in heat transfer, thermodynamics, and solid mechanics
  • Hands-on experience with multiphysics simulation tools like Ansys, Abaqus, Fluent, Star-CCM+, or FloTHERM
  • Ability to model and interpret thermal resistance, heat spreading, stress, and material interaction effects
  • Experience with finite element modeling (FEM) and coupled thermal-structural simulations

Responsibilities

  • Develop high-fidelity thermal and thermo-mechanical models for HBM packages
  • Perform multiphysics simulations to evaluate performance and guide design decisions
  • Analyze thermal transport and thermo-mechanical behavior in stacked memory architectures
  • Drive simulation-to-silicon correlation to validate models with characterization teams
  • Evaluate material properties and layout effects on thermal performance
  • Collaborate with cross-functional teams for thermally-aware product development
  • Provide actionable design recommendations based on simulation results
  • Contribute to the development of scalable simulation methodologies for HBM technologies

Benefits

  • Choice of medical, dental, and vision plans
  • Income protection programs for illness or injury
  • Paid family leave
  • Robust paid time-off program
  • Paid holidays
Full Job Description
Job Description:

The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via) technology, dramatically increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows, and we are targeting the lowest power per bit in the industry.

Micron is seeking a highly motivated HBM Thermal Simulation Engineer to develop and execute advanced thermal and thermo-mechanical simulations for next-generation High Bandwidth Memory (HBM) products. This role focuses on predicting, understanding, and optimizing thermal behavior across complex 2.5D/3D semiconductor packaging systems through physics-based modeling and silicon correlation.

Key Responsibilities:
  • Develop high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system-level integration.
  • Perform multiphysics simulations (thermal, structural, and coupled analyses) to evaluate performance, identify risks, and guide design decisions.
  • Analyze and explain thermal transport, heat flux distribution, and thermo-mechanical behavior across complex stacked memory architectures.
  • Drive simulation-to-silicon correlation by working with characterization and test teams to validate models and refine assumptions.
  • Evaluate material properties, layout effects, and package architecture on thermal resistance and hotspot behavior.
  • Collaborate cross-functionally with design, packaging, process, and test teams to enable thermally-aware product development.
  • Provide actionable insights, design recommendations, and risk assessments based on simulation results.
  • Contribute to development of modeling methodologies and scalable simulation frameworks for HBM and advanced packaging technologies.


Qualifications:
  • MS + 3years experience or PhD in Mechanical Engineering, Materials Science, Physics, or a related field.
  • Experience in thermal simulation or multiphysics modeling within semiconductor or advanced packaging domains.
  • Strong foundation in heat transfer, thermodynamics, and solid mechanics.
  • Hands-on experience with multiphysics simulation tools (e.g., Ansys, Abaqus, Fluent, Star-CCM+, FloTHERM or equivalent).
  • Demonstrated ability to model and interpret thermo-mechanical phenomena such as thermal resistance, heat spreading, stress, and material interaction effects.
  • Experience with finite element modeling (FEM) and coupled simulations involving thermal and structural domains.


Preferred Skills:
  • Understanding of semiconductor packaging technologies, including HBM, 2.5D/3D integration, TSVs, hybrid bonding, and interposers.
  • Familiarity with material characterization and effective thermal property extraction across layered or heterogeneous systems.
  • Knowledge of simulation-to-silicon calibration workflows and experimental validation techniques.
  • Exposure to CFD or flow-based simulation for cooling or package-level heat transfer.
  • Scripting or data analysis skills (Python, MATLAB, JMP) to automate simulations and analyze results.


As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

About Micron Technology

Micron Technology Careers

Join the vibrant team at Micron Technology, a leader in memory and storage solutions, and propel your career into the future of technology. At Micron, we are committed to fostering a culture of diversity and innovation, offering a range of job opportunities that encourage professional growth and leadership development.

Work You’ll Do

At Micron Technology, you will collaborate with some of the brightest minds in the industry, working on groundbreaking projects that redefine how the world uses information to enrich life. Our team is dedicated to leading through a unique position in the marketplace, at the intersection of technology, industry expertise, and digital innovation.

Explore Micron Technology’s Career Opportunities

Whether you are looking for an internship, a full-time position, or a leadership role, Micron offers a path to personal and professional growth. We are hiring across multiple disciplines, seeking passionate, curious, and innovative team players.

Innovative Work

Join our global team of professionals and be part of a company that values innovation and leadership. Micron provides targeted solutions and technologies that are integral to advancing how the world works, learns, and plays.

Be Part of a Great Team

Experience Micron’s inclusive culture where we value diversity and provide extensive benefits to ensure the well-being of all our team members. Engage in networking opportunities within the company to expand your skills and advance your career.

Future-Proof Your Career

Micron is dedicated to your career development, offering unmatched training, development programs, and certification support to help you reach your goals. Our commitment to innovation and leadership in the memory and storage industry ensures that your work at Micron is not just a job, but a pathway to future opportunities.

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Learn more about Micron Technology
Size
43,000 employees
Market Cap
$53.7 billion
Industry
Manufacturing & Automotive
Net Income
$2.9 billion
Founded
1978
5 Year Trend
+8.6%
Revenue
$22 billion
NASDAQ
MU
* Ladders Estimates

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