Apple is seeking an experienced Engineering Program Manager to lead Analog, Mixed-Signal, and Silicon Photonics IP programs within our silicon organization, with a focus on data center SoCs. In this role, you will drive the end-to-end development of high-speed AMS and optical IPs, including SerDes, PLLs, Data Converters, TIAs, drivers, and Silicon Photonics engines / optical I/O subsystems, from early concept through mass production, ensuring quality, schedule, and successful delivery across our SoC portfolio.
You will bring deep familiarity with advanced packaging technologies (including 2.5D/3D near and co-packaged optics), cutting-edge silicon nodes, SiPh process platforms, and AMS IP development flows and methodologies in an SoC environment. You will serve as the connective tissue across SoC Integration, IC Design, SoC PD, SoC DV, Photonics Design, Optical Packaging, CAD, Software, Hardware, Reliability, and Legal - defining test structure requirements, establishing robust electrical and optical testing methodologies, and ensuring all technical and compliance gates are met on schedule.
Your ability to distill complex electro-optical technical information into clear communication, identify risks across a multi-disciplinary supply chain (foundries, OSATs, laser and optical component vendors), develop mitigation strategies, and align diverse cross-functional stakeholders will be critical to delivering on aggressive hardware milestones for data center silicon.
Minimum Qualifications
BS in Electrical Engineering, Electrical and Computer Engineering, Applied Physics, Optics, or a related field, and 10+ years of relevant experience.
Proven track record in AMS IP, Silicon Photonics, or optical interconnect design or design engineering management.
Preferred Qualifications
MS or PhD in Electrical Engineering, Physics (Optics), Photonics, Materials Science, or an equivalent field.
Hands-on program leadership experience with Silicon Photonics devices and subsystems (lasers, modulators, photodetectors, waveguides, MUX/DeMUX, grating/edge couplers) and/or optical I/O and co-packaged optics (CPO) for data center applications.
Extensive experience with AMS IPs supporting optical interconnects, including high-speed SerDes, TIAs, laser/modulator drivers, CDRs, and PLLs across advanced technology nodes.
Familiarity with optical packaging concepts: fiber-array attach, active/passive alignment, flip-chip and CoC/CoW/WLP assembly, and thermal / reliability considerations for photonic packages.
Proven leadership in delivering high-reliability AMS and/or photonic IPs for data center infrastructure at scale.
Demonstrated ability to define and drive multi-generational IP and optical interconnect roadmaps in alignment with product strategy and business objectives.
Established track record of executive-level influence and stakeholder management across large, matrixed organizations spanning silicon, photonics, packaging, and supply chain.
Deep expertise in advanced EDA tools, IP development methodologies, and SoC integration across cutting-edge technology nodes for data center platforms.
History of proactive risk management and real-time crisis leadership in high-complexity, high-visibility programs with direct executive accountability.
Experience with adjacent optical technologies (uLED, uVCSEL) and their applications to SoCs is a plus.
