Job Purpose We are seeking an industry expert to lead the process architecture and development for our next-generation optical and microelectronic process solutions.
In this pivotal role, you will act as the technical anchor for our product solutions team. You will not simply run processes; you will define the assembly strategy from the ground up. Bridging the gap between R&D and high-volume manufacturing, you will own the end-to-end process lifecycle-from initial concept and recipe development to equipment selection and final release-to-manufacturing.
If you are a hands-on expert in flip-chip, wire bonding, and advanced optical packaging who thrives on solving complex device physics challenges, we want you to lead our technical vision.
Key Responsibilities Process Architecture & Development - Define the Strategy: Conceptualize and develop comprehensive assembly strategies for complex optoelectronic modules, ensuring alignment with device physics, thermal requirements, and throughput goals.
- Advanced Packaging Execution: Lead the hands-on development of critical process recipes, including Flip Chip, Underfill, Die Attach (epoxy & eutectic AuSn), and Wire Bonding (ball/wedge).
- Equipment Leadership: Research, specify, and procure capital equipment. Oversee acceptance testing (SAT/FAT) to ensure new capabilities meet technological roadmaps.
NPI & Design for Manufacturability (DFx) - Design Partnership: Act as the primary feedback loop to the internal design team and external customers. Provide expert DFx (Design for Assembly/Manufacturing) guidance to optimize yield and reliability before prototypes are built.
- Tooling & Fixturing: Conceptualize and drive the design of custom tooling and fixtures required for novel assembly techniques.
- Customer Interface: Serve as the primary technical liaison for customers during the development phase, translating their requirements into viable manufacturing processes.
Quality, Analysis & Control - Rigorous Methodology: Implement robust process controls using PFMEA and Control Plans.
- Root Cause Analysis: Lead complex troubleshooting efforts using methodical approaches (8D, etc.) to resolve yield excursions or performance issues.
- Documentation: Author and approve high-level process assembly documentation and process qualification reports.
Mentorship & Leadership - Technical Mentorship: Act as a subject matter expert and mentor to junior and intermediate engineers, fostering a culture of technical excellence and best practices.
- Project Management: Manage engineering timelines and milestones to ensure customer NPI builds are delivered on schedule.
Required Experience & Education: - Master's Degree in Engineering (Materials, Electrical, Mechanical, or Physics).
- Minimum8+ years of direct, hands-on experience in microelectronics packaging and process engineering.
- Core Competencies: deep expertise in Flip Chip and Wire Bonding (Chip & Wire) processes is non-negotiable.
- Material Science: Strong understanding of material interactions, including underfills, epoxies, and gold-tin (AuSn) soldering/reflow processes.
Technical Skills: - Proficiency in programming automated assembly equipment (pick-and-place, dispensers, wire bonders).
- Demonstrated experience driving Engineering Change Orders (ECOs) and process qualifications.
- Strong background in statistical process control (SPC) and data analysis.
Preferred Assets: - Experience specifically within the Photonics/Microelectronics sector.
- Proficiency with CAD tools (AutoCad, SolidWorks) for tooling design.
- Knowledge of Lean Manufacturing and Six Sigma principles.
Why Join Us? - Impact: Work on cutting-edge technologies that are shaping the future of connectivity.
- Location: Based in the heart of Canada's tech hub in Kanata, ON.
- Growth: A visible role with the opportunity to shape the engineering culture and technical roadmap of the organization.
OTHER INFORMATION - The compensation range for this position is $145,000 - $165,000 annually.
- This position is for an existing vacancy.
- The hiring process for this position does not use Artificial Intelligence (AI).
