RFIC Thermal Engineer

Falcomm

$90K — $120K *
Telecommunications & Hardware
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
  • 3-5 years experience with thermal analysis, modeling, or simulation in semiconductor or electronic systems.
  • Strong understanding of heat transfer principles and thermal management techniques for RFICs and MMICs.
  • Willingness to work full-time, onsite, in Atlanta, GA.

Responsibilities

  • Develop thermal models for RFIC devices to assess heat dissipation and temperature dynamics.
  • Perform thermal simulations to enhance design optimization and reliability.
  • Collaborate with RFIC and packaging teams to devise effective thermal management strategies.
  • Evaluate thermal performance using various packaging technologies and materials.
  • Support silicon validation concerning thermal characteristics.
  • Analyze thermal failure mechanisms and propose improvements in design or processes.
  • Document analysis techniques, outcomes, and suggestions.

Benefits

  • Competitive Salary and Equity Package
  • Comprehensive Health, Dental, and Vision Insurance
  • 401(k) Retirement Plan
  • Paid Time Off (PTO) and Sick Leave
Full Job Description
Falcomm is seeking an RFIC Thermal Engineer to analyze, model, and optimize thermal performance in RF integrated circuits and semiconductor packages. This role will focus on understanding heat dissipation, thermal reliability, and thermal management strategies for high-power RF devices. The position requires collaboration with RFIC designers, packaging engineers, and system teams to ensure devices operate reliably under demanding performance conditions.

Responsibilities:
  • Develop thermal models for RFIC devices, packages, and modules to evaluate heat dissipation and temperature distribution.
  • Perform thermal simulations and analysis to support design optimization and reliability improvements.
  • Collaborate with RFIC design and packaging teams to develop thermal management strategies.
  • Evaluate thermal performance across different packaging technologies and materials.
  • Support silicon validation and characterization related to thermal performance.
  • Analyze thermal failure mechanisms and recommend design or process improvements.
  • Document analysis methods, results, and recommendations.


Requirements
  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
  • 3-5 years experience with thermal analysis, modeling, or simulation in semiconductor or electronic systems.
  • Strong understanding of heat transfer principles and thermal management techniques for RFICs and MMICs.
  • Must be willing to work full-time, onsite, in Atlanta, GA.


Preferred Skills:
  • Experience with thermal simulation tools such as ANSYS, COMSOL, or similar platforms.
  • Familiarity with semiconductor packaging technologies and thermal interface materials.
  • Experience analyzing high-power devices such as RF amplifiers or high-frequency ICs.
  • Strong analytical and problem-solving skills with the ability to collaborate across engineering teams.


Benefits
  • Competitive Salary and Equity Package
  • Comprehensive Health, Dental, and Vision Insurance
  • 401(k) Retirement Plan
  • Paid Time Off (PTO) and Sick Leave


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