The Northrop Grumman Microelectronics Center (NGMC) within Northrop Grumman Mission Systems is seeking Microelectronics Process Engineer to join our team at the Space Park Foundry (SPF) in Manhattan Beach, CA. At SPF, we design, manufacture, and test semiconductor products for both internal and commercial customers, as well as for emerging technology programs. Our Space Park semiconductor foundry supports various production microelectronics technologies, including Gallium Arsenide, Indium Phosphide, Silicon Carbide, and Gallium Nitride. Additionally, we drive cutting-edge technology development in areas such as 3D Heterogeneous Integration, semiconductor materials, manufacturing processes, and advanced transistors. These advanced technological capabilities are crucial performance differentiators for many of Northrop Grumman’s ground, avionic, and space systems. 

As a Microelectronics Process Engineer you will support the research, development, and production of advanced microelectronics products for the Northrop Grumman Microelectronics Center. You will be responsible for development, maturation, and sustaining microelectronics fabrication process flows in our Class 10 cleanroom facility. You will be able to participate in and lead multi-disciplinary teams to advance new technologies from early research and development to production. Responsibilities will include close collaboration with materials, products, and reliability engineers in developing and carrying out process module characterization, product manufacturing flows, and process deviation root cause analysis. You thrive in a fast-paced work environment with high expectations, significantly diverse assignments, while in a collaborative team setting across all levels. You are self-motivated, proactive, and able to independently find solutions to complex problems. 

Essential Job Functions include, but are not limited to: 

• Ownership of process module development, module maturation, and integration of multiple modules for successful product delivery. 

• Continuously improve the process control and yield of existing semiconductor microelectronics product lines and technology nodes. 

• Evaluation, down-selection, and production qualification of new process tool capital acquisitions.  

• Maintain existing cleanroom process modules and tools: monitoring processes using statistical process control (SPC) methods; process optimization; and troubleshooting process issues (root cause and corrective action investigations). 

• Work in a team environment, using excellent communication and presentation skills to effectively interface with management, manufacturing control boards, and personnel from other areas; ability to multi-task, ability to succinctly document and/or summarize their work, and ability for independent thinking. 

• Mentor and support junior engineers through tasks and projects. 

This requisition may be filled as a Principal Microelectronics Device Engineer or Senior Principal Microelectronics Device Engineer

Basic Qualifications for Principal Microelectronics Process Engineer:

• Bachelor of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or other related STEM discipline with 5 years of relevant experience (3 years with a Master’s degree and 0 with a PhD).

• Direct experience in semiconductor device process design and troubleshooting. 

• Direct experience in semiconductor process module development and integration into an entire process flow. 

• Ability to obtain and maintain a DoD Top Secret clearance. 

• US Citizenship required

Basic Qualifications for Senior Principal Microelectronics Process Engineer:

• Bachelor of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or other related STEM discipline with 8 years of relevant experience (6 years with a Master’s degree and 3 with a PhD).

• Direct experience in semiconductor device process design and troubleshooting. 

• Direct experience in semiconductor process module development and integration into an entire process flow. 

• Ability to obtain and maintain a DoD Top Secret clearance. 

• US Citizenship required

Preferred Qualifications:

• PhD in a STEM field closely aligned to semiconductor microelectronics fabrication. 

• Hands-on, in-lab experience with compound semiconductor processing. 

• Hands-on experience with semiconductor wafer electroplating (e.g. Au, Ni), including sustaining and process development activities.

• Experience in root cause and corrective action (RCCA) methodologies such as: 8D, FMEA. 

• Active DoD Top Secret clearance.