About the RoleWe are seeking a visionary Principal/Master Engineer to lead our packaging and assembly development, driving the realization of a highly scalable silicon photonics platform. In this role, you will leverage advanced 2.5D/3D packaging technologies to bridge the gap between design and volume manufacturing.
As the primary technical lead and single point of contact for all packaging design and process development, you will collaborate closely with internal PIC/IC design teams, opto-mechanical designers, and assembly engineers. Externally, you will spearhead engagements with Outsource Semiconductor Assembly and Test (OSAT) partners to pioneer wafer- and chip-scale packaging processes, establish robust Design for Manufacturing (DFM) rules, and seamlessly manage New Product Introduction (NPI) through to high-volume production.
Key Responsibilities- Technical Leadership: Serve as the lead for all advanced packaging design, substrate definition, and assembly process development activities.
- Cross-Functional Collaboration: Partner with PIC, IC, opto-mechanical design and process teams to align package architectures with electrical, optical, and thermal requirements.
- OSAT & Supplier Management: Lead external OSATs/CMs through wafer and chip-scale assembly development. Define, document, and enforce packaging specifications and design rules.
- Yield & Production Ramp: Troubleshoot complex assembly issues, implement risk-mitigation strategies for critical assembly nodes, and drive yield optimization to ensure a smooth transition from NPI to volume production.
- Innovation & DFM: Drive the evaluation and deployment of next-generation 2.5D/3D packaging technologies, guiding cross-functional teams toward data-driven DFM decisions.
Requirements & Qualifications- Education : MS or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Optical Physics, or a related engineering discipline.
- Experience : 15+ years of hands-on experience in semiconductor advanced packaging, opto-mechanical design, silicon photonics assembly, or manufacturing operations.
- Technical Expertise : Advanced Packaging: Deep, detailed understanding of wafer, chip, and board-level assembly processes, specifically 2.5D/3D integration techniques, and their distinct advantages/trade-offs when applied to photonics.
- Product Track Record: A proven history of developing high-yielding optical products, with a strong preference for silicon photonics-based platforms.
- Operations & Vendor Management: Demonstrated operational experience managing OSATs/CMs, including setting process control windows, troubleshooting line excursions, and directing yield engineering.
- Leadership & Soft Skills : Exceptional problem-solving skills with a track record as an independent thinker and decisive technical leader.
Compensation and BenefitsThe annual base salary range for this position is USD 167,500.00 To USD 268,000.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence. 
