OPEN JOB: Principal Application Engineer - semiconductor packagingLOCATION: Irvine, California
***Relocation Assistance Available INDUSTRY: Manufacturing & ProductionBASE SALARY: $130,000 to $155,000This position is with our client's Adhesive Technologies business unit (adhesives, sealants and functional coatings)
What you'll do - Develop and evaluate KPI results and drive innovation and continuous improvement via data driven decisions and actions
- Leverage semiconductor knowledge in advanced packaging e.g. 2.5D, HBM, CoWoS technical requirement and trend to accelerate material testing and test vehicle development
- Primary technical interface to leading edge clients, addressing and resolving issues related to product implementation, functionality, or performance
- Responsible for application functions and tasks to sales, marketing, PD and other business units
- Manage a small (2-4) Application Engineering team to achieve project deliverables
Requirements:- Bachelor's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field
- 12 years of experience in semiconductor packaging or processes with people manager experience
- Solid understanding of current and emerging packaging trends, including 2.5D and 3D packaging
- Proven ability to work independently and lead technical discussions with customers
- Strong communication skills with a customer-focused, ownership-driven mindset
- Effective project and time management skills, with a consistent focus on quality and delivery
- Willingness to travel up to 10%
- Ability to take meetings with our APAC team during off-hours
If you are interested in pursuing this opportunity, please respond back and include the following:
- MS WORD Resume
- required compensation.
- Contact information.
- Availability
Upon receipt, one of our managers will contact you to discuss the position in full detail.
STEPHEN FLEISCHNERRecruiting ManagerINTERMEDIA GROUP, INC.EMAIL: [email protected]LINKEDIN: https://www.linkedin.com/in/stevefleischner/
