Job Details:Job Description: About the Role
Join Intel’s Advanced Packaging Technology and Manufacturing team and help shape the future of semiconductor packaging. In this role, you will develop and optimize cutting-edge equipment and processes that enable next-generation packaging solutions.
Your work will directly impact product performance, manufacturability, and reliability at scale supporting innovations that power computing advancements globally.
What You’ll Do
Key responsibilities will include but not limited to:
- Develop, qualify, and optimize semiconductor packaging equipment and processes to meet quality, yield, cost, and reliability targets
- Apply statistical methods (DOE, SPC) to analyze process performance and drive continuous improvement
- Design and execute experiments to validate packaging technologies under environmental stress conditions (e.g., thermal cycling, humidity, mechanical forces)
- Collaborate cross-functionally with design, manufacturing, and suppliers to ensure scalable and manufacturable solutions
- Define equipment specifications and partner with vendors to meet technical and performance requirements
- Identify and resolve packaging-related reliability issues using data-driven approaches and failure analysis techniques
- Lead technical problem-solving efforts and contribute to process innovation initiatives
- Document findings and best practices through technical reports and knowledge-sharing forums
- Support standardization of qualification processes, quality systems, and engineering methodologies
Behavioral traits that we are looking for:
- Strong analytical and problem-solving mindset
- Effective written and verbal communication skills
- Ability to work independently and collaboratively in a team environment
- Adaptability in a fast-paced, innovation-driven setting
- Continuous improvement mindset with attention to detail
Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.
See for more details.
Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Note:
For information on Intel’s immigration sponsorship guidelines, please see
Minimum Qualifications and Experience:
Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience. Or a Master's degree in the same field with 2 years of experience and a PhD in the same field.
Your experience described above must be in the following:
- Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- Mechanical design software such as SolidWorks or AutoCAD.
- Mechanical drawings and Geometric Dimensioning and Tolerancing.
Preferred Qualifications and Experience:
- Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
- Experience with high-precision manufacturing methods, including stamping and CNC machining.
- Understanding of semiconductor fabrication processes and packaging technologies.
- Familiarity with supply chain management in a manufacturing or materials qualification environment.
- Previous related work experience in a semiconductor foundry preferred.
Be part of Intel's mission to innovate and advance the future of technology. Apply today to make an impact and shape the future of packaging solutions.
Job Type:Experienced Hire
Shift:Shift 1 (United States of America)
Primary Location: US, Arizona, Phoenix
Additional Locations:
Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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