Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape. You will directly contribute to the development, optimization, and integration of processes and equipment that shape the future of product performance, quality, and reliability. By leveraging your technical expertise, you will help ensure that Intel delivers exceptional results to meet the demands of a rapidly evolving industry.

Key Responsibilities:

• Design and develop assembly processes and equipment to enable future packaging technologies.
• Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Create and maintain specifications for processes and equipment using Design of Experiments (DOE) and data analysis principles.
• Conduct tests under simulated field conditions, including heat, humidity, temperature cycling, and dynamic forces, to evaluate silicon and packaging technologies.
• Oversee the manufacturability of package designs and manage their manufacturing cycles.
• Establish material specifications and collaborate with supplier quality and procurement teams to ensure compliance with performance requirements.
• Develop innovative techniques, tools, and quality screens to assess packaging quality and reliability.
• Set reliability standards based on a strong understanding of failure mechanisms and influence design, material selection, and process development accordingly.
• Provide consultation and technical support for packaging process improvements and respond to customer and client needs.
• Drive standardization in product qualification and manufacturing quality systems while collaborating with engineering teams to meet key product milestones.

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field with 1+ years of relevant experience or Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field.

• Experience listed above should be a combination of the following:

  • Familiarity with equipment adjustment, process characterization, and manufacturability or electronics assembly.

Preferred Qualifications

• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

• Hands-on experience in a technology manufacturing environment or semiconductor packaging processes.

• Demonstrated ability to collaborate with cross-functional teams and contribute to time-sensitive projects.

We invite you to apply and bring your expertise, creativity, and passion for innovation to Intel. Be a part of our mission to create world-class packaging solutions and help shape the future of technology.

Work Model for this Role

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