This role will serve as the technical process owner for backend packaging and continuity testing tool, supporting our advanced displays from prototyping through production. As an engineer you would drive process development, yield, and manufacturability on our microdisplay production line.  

Additionally you will: 

• Own and optimize a backend packaging process for LCOS advanced displays, from early development through high-volume manufacturing, ensuring stable, high-yield output.

• Act as the primary technical interface for equipment, materials, and manufacturing partners, overseeing tool qualification, process capability, build readiness, and issue resolution.

• Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.

• Lead structured problem solving (DOEs, FMEA, root cause analysis, corrective actions) for yield excursions, line stops, and parametric drifts.

• Partner with cross-functional teams to define capacity models and WIP/uptime strategies.

• Hands-on experience with automated packaging equipment, including recipe setup, tuning, and troubleshooting.

• Proven ability to function as a module owner in a high-volume fab or OSAT environment, balancing NPI design transfer activities and roadmap work.

• Exceptional problem solver with a structured, solution focused approach, leveraging advanced statistical tools to improve yield and stability in packaging.

• Comfortable working in an ISO 5 cleanroom environment and enforcing best practices in contamination control, safety, and EHS compliance.

• BS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field

• 7+ years of experience as a process or packaging engineer in microfabrication fabs.

• Direct experience designing and optimizing automated production equipment for semiconductors or displays

• Direct experience in final test for semiconductor or display packages.

• Demonstrated track record of improving yield and process stability through structured experimentation (DOE), SPC, and cross-functional problem solving.

• Experience planning and executing process transfers from R&D to production lines.

• International travel between Taiwan, U.S., and supplier sites (up to ~10%).

• 10+ years of experience in process engineering and backend packaging.

• Ownership of  module performance and direct collaboration with applications engineers.

• Excellent problem solver with a foundation in Six Sigma.

• Experience with automated optical assembly and test equipment.

• Experience developing and sustaining wire bonding processes (materials, bond parameters, loop profiles, pad design interfaces) for high‑density LOCS packages.

• Strong expertise in backend assembly processes for advanced displays, including die attach, marking, and final packing.

"Default Together" Policy at Snap: At Snap Inc. we believe that being together in person helps us build our culture faster, reinforce our values, and serve our community, customers and partners better through dynamic collaboration. To reflect this, we practice a “default together” approach and expect our team members to work in an office 4+ days per week. 

: Snap Inc. is its own community, so we’ve got your back! We do our best to make sure you and your loved ones have everything you need to be happy and healthy, on your own terms. Our benefits are built around your needs and include paid parental leave, comprehensive medical coverage, emotional and mental health support programs, and compensation packages that let you share in Snap’s long-term success!

Compensation

In the United States, work locations are assigned a pay zone which determines the salary range for the position. The successful candidate’s starting pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions. The starting pay may be negotiable within the salary range for the position.These pay zones may be modified in the future.

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Zone C: