The Advance Packaging Technology Development APTD SWA is at the center of making Intel Foundry's and APTM's advanced package substrate roadmap a reality. We do this by collaborating with our internal Integration team to demonstrate disruptive packaging architectures and integrate them into certifiable products. The Process TD Engineer's real-time support of integrated DOEs, NPIs, BLOs, process/defect characterizations, and excursion response enables 24x7 lot movement through our pilot line. This role involves close collaboration with Integration, program leads, and functional partners for the timely qualification of new materials and process flows. IOS capability is vital for APTD: SWA to meet customer expectations in the ultra-competitive foundry environment. The ideal candidate thrives in faster paced manufacturing environments where continuous learning and development and operational execution are key to the team's overall success.

Daily Responsibilities:

1. Assist factory velocity and quality efforts. Prepare to spend the majority of the shift in the factory supporting the floor in collaboration with Tool Owners (TOs) and Manufacturing Techs (MTs) when required.
2. Proactively align on daily priorities with Segment Integration and Program Management teams. Flawlessly communicate with day shift stakeholders on any issues requiring immediate follow up as they arrive on shift.
3. Provide engineering-level support throughout the shift, managing daily lot execution with intense focusing on route/DOE setup and data review to ensure program deliverables are achieved.
4. Respond to process issues, error recoveries and ad hoc requests by the factory making timely disposition decisions when required.
5. Utilize model-based problem solving (MBPS) and informed judgment on problems requiring deviation from standard practices.
6. Perform feasibility studies and provide integrated process solutions to meet safety, quality, reliability, and output requirements.
7. Select and develop materials and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
8. Collaborate with development and material suppliers to develop processes and equipment needs to meet technology roadmaps.
9. Plan and conduct experiments to characterize the process and improve performance for specific products throughout the development cycle.
10. Identify integrated process solutions to resolve issues or specific requests from customers by partnering with product engineering and module engineering teams.
11. Conduct new product qualifications and technology transfers from fabrication operations.
12. Leverage big data analysis to identify process design weaknesses and manufacturing tool issues, proposing corrective, data-driven solutions.
13. Write and update specs and BKM's as needed.
14. Author white papers and secure change control board prior to implementation.
15. Provide detailed written and verbal pass down for to ensure seamless transition to shift counterparts.

Behavioral Traits:

• Strong technical foundation with a willingness to learn complex process flows, route change requirements, and manufacturing systems while maintaining meticulous attention to detail and quality execution.
• Collaborative leadership mindset that embodies Intel's core values, particularly Customer First, One Intel, and Quality, with demonstrated ability to build trust across cross-functional teams and support 24/7 operational continuity.
• Proactive problem-solving capabilities with the confidence to take initiative, investigate issues independently, and provide strategic recommendations while maintaining transparent communication with stakeholders.
• Growth-oriented mentality that embraces continuous learning, seeks feedback, and demonstrates the resilience to transform challenges into development opportunities while maintaining high-performance standards.
• Reliable follow-through with proven ability to prioritize effectively, execute flawlessly with a right first-time approach, and consistently deliver results that delight internal and external customers.
• Strong interpersonal skills including a willingness to mentor others, facilitate knowledge transfer, and communicate technical concepts clearly across the organization.

Shift 6: (nights backend) PM-AM Wed-Sat and alternating Saturday night (6:00 PM–6:00 AM).

You must possess the below minimum qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Bachelor's Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or other similar engineering or a STEM-related field with 1+ years of experience with manufacturing processes.
• This position is not eligible for Intel immigration sponsorship.

Preferred Qualifications:

• General knowledge of the semiconductor packaging process.
• Experience owning process tools with knowledge of SPC, PCS, equipment troubleshooting, statistical design of experiments, and process development.
• Experience working with a broad team of other Processers
• Defects characterization experience
• Experience effectively communicated investigation findings and recommendations to stakeholders, ensuring clarity, alignment, and informed decision-making.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Work Model for this Role

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