Advanced Micro Devices, Inc

Foundry 3D Packaging Engineer

Advanced Micro Devices, Inc$110K — $130K *
Technical Services
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • 5-7 years of experience in process integration for advanced packaging technologies.
  • Expertise in BEOL integration, 3D integration with TSV, and hybrid bonding techniques.
  • Strong experience in design for manufacturing (DFM) and design for yield (DFY) principles.
  • Solid foundation in defect analysis and reliability testing methodologies.
  • Master's degree or PhD in materials, mechanical, chemical, or electrical engineering.

Responsibilities

  • Drive technology development of advanced 3D package architectures.
  • Execute and coordinate proof of concept for new technologies.
  • Manage design of experiments for material selections and process validation.
  • Define and conduct quality and reliability tests including failure analysis.
  • Collaborate with architects and designers to create cost-effective packaging solutions.
  • Lead process optimization for yield and reliability improvements.
  • Facilitate the transition of new products to high-volume manufacturing environments.

Benefits

  • Comprehensive health and wellness plans.
  • Retirement savings options with company contributions.
  • Employee stock purchase program.
  • Flexible work environment support.
  • Opportunities for continuous learning and professional development.
Full Job Description
THE ROLE

As part of the AMD's Advanced Packaging team, you will drive technology development of advanced 3D package architectures. The scope includes but not limited to: execute and coordinate proof of concept on new technology; product bring up and continue yield and reliability improvement to meet performance, cost, and schedule requirements to support new AMD products.

THE PERSON

The candidate should have a proven track record and extensive knowledge and experience in wafer process Integration, such as BEOL Integration, 3D integration with TSV (through silicon via) and Hybrid Bonding (CoW and W2W) etc. The candidate should have a hands-on approach to process bring up and development as well as excellent oral and written communication skills to communicate ideas with Foundry Partners, Suppliers, Internal Stakeholders and AMD Management.

KEY RESPONSIBILITIES
  • Drive/participate in defining FMEA (failure mode effects analysis), TV Design, DFM (design for manufacturing), and DFY (design for yield). Manage DOE (design of experiments) plan and execution for material selections, process window validation. Defining quality and reliability tests including defect detection and FA (failure analysis) methodology
  • Partner with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions which meet product requirements. Transfer the new product into a high yielding, cost-effective, high-volume manufacturing environment.

Enable development partners in the AMD Ecosystem to bring up new packaging technology/process from concept to NPI and prototyping to mass production. lead and perform process optimization, yield and reliability improvement.

PREFERRED EXPERIENCE
  • Fundamental knowledge and experience with BEOL (Back End of Line) process, TSV integration and Hybrid bonding process and defect metrology.
  • Strong knowledge and experience in design and reliability, such as TV design, CPI, Thermo-mechanical analysis, DFR (design for reliability) etc.
  • Strong knowledge with Advanced Packaging Techniques, including fan-out, 3D stacking, 2.5D and MCM (multi chip module) packaging techniques.
  • Experience in the industry with strong problem solving, communication, organizational, interpersonal, and presentation skills.


ACADEMIC CREDENTIALS
  • Master of Science/PhD in materials, mechanical, chemical, or electrical engineering.


This role is not eligible for visa sponsorship.

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Benefits offered are described: AMD benefits at a glance.

About Advanced Micro Devices, Inc

Advanced Micro Devices, Inc. Careers

Join the innovative forefront of technology with a career at Advanced Micro Devices, Inc. (AMD), a leader in semiconductor development. As part of our global team, you will contribute to an organization renowned for its dedication to innovation, leadership, and diversity in the tech industry.

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Learn more about Advanced Micro Devices, Inc
Size
15,500 employees
Market Cap
$100.9 billion
Industry
Net Income
$2.4 billion
Founded
1969
5 Year Trend
+30.9%
Revenue
$9.7 billion
NASDAQ

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