Application close date:
Applications will be accepted on an ongoing basis until the requisition is closed.
Job OverviewWe are seeking a electrical engineer to help develop the RF payload hardware for our revolutionary TeraWave satellite communications network. This role will be instrumental in establishing electrical engineering excellence for our hardware systems, supporting a next-generation constellation designed to deliver an aggregate global network capacity of up to 6 Tbps. You will act as the critical engineering bridge, integrating complex high-speed digital logic with advanced phased array antenna systems.
Core responsibilities include, but are not limited to- Develop multi-layer, high-density interconnect (HDI) PCB design, ensuring strict isolation between high-speed digital lines and sensitive microwave routing.
- Design highly efficient power systems (PoE, DC-DC converters, PMICs) capable of handling the high dynamic current swings required during beamforming operations.
- Perform simulation and analysis to minimize noise, crosstalk, and electromagnetic interference (EMI) across the entire system.
- Lead the physical bring-up, hardware debugging, and functional lab testing of the system-level boards.
Required Qualifications- Bachelor's degree in electrical engineering or a related technical field.
- 3+ years of experience in complex hardware product development (e.g., telecom hardware, 5G base stations, or aerospace electronics).
- Proficiency in EDA tools (e.g., Altium Designer, Cadence Allegro) with direct experience handling schematic capture and layout guidelines for high-speed, multi-layer mixed-signal boards.
- Hands-on experience using high-speed scopes, spectrum analyzers, and vector network analyzers (VNAs) for hardware debug.
- Proven track record of supporting hardware through the entire lifecycle, from initial concept and design through integration, testing, and field operations.
Preferred Qualifications- Master's degree in electrical engineering or a related technical field.
- Familiarity with satellite communication protocols (LEO/GEO systems) or commercial high-speed wireless infrastructure (5G sub-6GHz/mmWave, Wi-Fi 6E/7).
- Direct experience collaborating with antenna or RF specialists to co-design and optimize the physical interface between PCBs and radiating elements (e.g., rigid-flex PCBs, board-to-board RF connectors).
- Experience designing hardware architecture around high-performance Xilinx/AMD Zynq SoCs, Altera/Intel FPGAs, or high-speed ARM processors.
- Proven track record of designing for and successfully passing regulatory compliance testing (FCC Part 15/25, CE, ETSI) for intentional radiators.
- Knowledge of thermal management strategies for high-power density boards and design practices for outdoor, weather-proof environments (IP67+ ratings).
Base Pay Range for:
WA applicants is $107,136.00 - $149,990.40
Other site ranges may differBenefits- Benefits include: Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with a company match of up to 5%, and an Education Support Program.
- Stock Options for all regular employees (working at least 20 hours/week)
- Paid Time Off: Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.
- Dependent on role type and job level, employees may be eligible for benefits and bonuses based on the company's intent to reward individual contributions and enable them to share in the company's results, or other factors at the company's sole discretion. Bonus amounts and eligibility are not guaranteed and subject to change and cancellation. Please check with your recruiter for more details.
