Position SummaryIn your role as the Chemical Vapor Deposition (CVD) / Thin Films 1st-level Process Engineering Leader to head the front-end-of-line (FEOL) process engineering sub team dedicated to processes within the NS, PC, SD, RPMG, CT-SDB, and MOL modules.
You'll manage and develop up to 15 engineers in this role.
Role and ResponsibilitiesHere's What You'll Be Responsible For:The process team lead must understand department objectives and provide effective oversight to their team members to achieve targets for safety, quality, and production.
Team - Goal-setting: Translating departmental goals into measurable tasks for their team. 2025 will focus on hitting key tool installation milestones to achieve capacity goals.
- Staffing: Hiring and work scheduling.
- Training: Developing training plans for new employees.
- Talent Development: Providing professional / career development feedback to their direct reports.
- Culture: Developing a high performance, learning-first team culture that aligns with the department and Samsung.
- Performance: Facilitating annual performance management and compensation process for their direct reports.
- Teamwork: Coordinate with external and internal teams to meet objectives.
- Process ownership assignment.
Technical - Providing technical guidance to direct reports for FEOL processes. The applicant should possess a high level of technical understanding of semiconductor processes and integration for advanced node devices.
- Developing / approving safety-minded standard operating procedures to guide wafer disposition.
- Understanding and managing risk when an abnormality or schedule deviation is detected.
- Ensuring the team adheres to sitewide safety standards and communicating safety bulletins to the team.
- Coordinating with tool vendors to prioritize process work and communicating help needs.
- Managing non-rpoduct wafer and qual lot schedules through mass production to meet manufacturing need dates.
- Communicating technical information to executive leadership.
- Defense line and automatic process control (APC) application to achieve film quality targets and minimize scrap.
- Co-work with equipment team to match new tool output to reference tool (tool-to-tool matching).
Skills and QualificationsHere's what you'll need:- Minimum educational requirement: Bachelor's degree in an engineering discipline (Chemical, Mechanical, Electrical) or related degree (Materials Engineering, Physics, Chemistry, etc.)
- Minimum work experience: 5+ years experience in high volume semiconductor manufacturing
- Leadership experience: 2+ years leadership experience of at least 5 or more people, or 4+ years technical leadership experience leading task force teams
- Legal authorization to work in the United States without sponsorship
The current base salary range for this role is between $113,500 - $200,500. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.
Total RewardsAt Samsung Austin Semiconductor, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.
We offer a comprehensive benefits package, including:
- Medical, dental, and vision insurance
- Life insurance and 401(k) matching with immediate vesting
- Onsite café(s) and workout facilities
- Paid maternity and paternity leave
- Paid time off (PTO) + 2 personal holidays and 10 regular holidays
- Wellness incentives and MORE
Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.
All positions at Samsung Austin Semiconductor are full-time on-site.
