Job Details:Job Description:The Role and Impact
Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique opportunity to contribute to the development of cutting-edge processes and equipment that enable Intel to stay at the forefront of innovation. Your work will directly impact the performance, quality, and reliability of Intel's assembly and packaging solutions, driving advancements in technology that address the dynamic needs of the semiconductor industry. Through technical expertise and collaboration with cross-functional teams, you will help Intel achieve its mission of delivering world-class packaging solutions.
Key Responsibilities
- Design and develop laser assembly packaging processes and equipment to enable next-generation packaging technologies.
- Optimize manufacturing processes to meet stringent quality, reliability, cost, yield, productivity, and manufacturability requirements.
- Develop process and equipment specifications using Design of Experiments (DOE) and data analysis principles.
- Oversee the manufacturability of physical layout designs and manage the full cycle of packaging processes, procedures, and flows.
- Establish laser process specifications and collaborate with suppliers to meet quality and performance standards.
- Innovate new techniques, tools, and quality screens for early identification of potential packaging quality and reliability issues.
- Set laser process reliability requirements based on a strong understanding of failure mechanisms, influencing design, material selection, and process development.
- Drive standardization in qualification procedures, manufacturing quality systems, and processes while collaborating with engineering teams to meet critical milestones.
Qualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications- Bachelor's degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field
- OR Master's degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field
Relevant experience should include the following:
- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- Fundamental understanding of laser and optical systems
Preferred Qualifications- Hands-on experience in a technology manufacturing environment or semiconductor packaging processes and troubleshooting laser based equipment/systems.
- Familiarity with equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly.
- Demonstrated ability to collaborate with cross-functional teams and deliver results in time-sensitive projects.
- Capability to apply Data Science and Statistics tools (Python, Numpy/Pandas, SQL, JMP, Minitab) to manipulate large complex data sets.
We invite you to bring your expertise, creativity, and passion for technology innovation to Intel. Join us in driving the future of semiconductor packaging and make a lasting impact on the technology landscape. Apply today.
Job Type:College Grad
Shift:Shift 1 (United States of America)
Primary Location:US, Arizona, Phoenix
Additional Locations:Business group: 
