Skyworks Solutions

Staff Reliability/FA Engineer

Skyworks Solutions$114K — $220K *
Consumer Technology
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • BS in Electrical/Computer Engineering with 8+ years or MS with 6+ years in FA and reliability engineering.
  • Expertise in digital CMOS, RF device fundamentals, and advanced circuit analysis.
  • Proven capability to lead complex investigations and develop innovative FA methodologies.
  • Extensive experience with FA tools like SEM, CSAM, X-ray CT, and microscopy.
  • Strong proficiency in PCB and IC design tools and RF/parametric test equipment.
  • Exceptional analytical and problem-solving skills with the ability to drive technical decisions.
  • Proficient in Microsoft Office applications.

Responsibilities

  • Lead comprehensive failure analysis investigations of electronic components.
  • Conduct parametric, RF, and system-level testing for accurate fault isolation.
  • Develop and implement innovative failure analysis techniques.
  • Offer guidance to design and quality teams on reliability-focused designs.
  • Mentor junior engineers and promote best practices in technical growth.
  • Drive initiatives to enhance product robustness and resolve critical failures.
  • Prepare and present high-level technical reports to senior management and clients.

Benefits

  • Access to premium-free medical plan options.
  • 401(k) plan with company matching contributions.
  • Employee stock purchase plan.
  • Paid time off including vacation and parental leave.
  • Participation in an incentive plan based on performance.
Full Job Description
Staff Reliability/FA Engineer Posting Start Date: 9/14/26 Job Location(s): Newbury Park Requisition ID: 78416 Job Description: **Description** Skyworks is seeking a Staff Reliability/FA Engineer at our Newbury Park, CA location. In this role, you will lead advanced failure analysis across component, module, and system levels. This senior role provides strategic technical leadership, ensuring robust root cause identification and driving corrective actions that enhance product reliability and quality. Oversee complex laboratory investigations, develop innovative FA methodologies, and influence design-for-reliability practices. Responsibilities include analyzing and reporting results to isolate electronic module and device-level failures, recommending test methods and FA control procedures, and ensuring compliance with company, customer, and regulatory reliability objectives. The position demands proactive development of new analytical tools to identify potential issues early in product development, packaging, and processes. Findings will guide design and material changes to improve system reliability. You may propose changes in design or formulation to improve system and/or process reliability based upon proven laboratory methods. **Responsibilities** - Perform comprehensive FA investigations via data analysis and troubleshoot electronic components including semiconductor chips, surface mount components, printed circuit boards and wire-bond and flip chip modules. - Devise and execute parametric, RF, and system-level testing, ensuring accurate fault isolation and root cause determination through application of engineering knowledge or coursework in digital CMOS and HBJT RF constructs and associated devices. - Develop and implement new FA techniques. - Provide expert guidance to design, quality, and test engineering teams, influencing design-for-reliability decisions. - Mentor junior engineers and technicians, fostering technical growth and best practices. - Drive cross-functional initiatives to improve product robustness and accelerate resolution of critical failures. - Prepare and deliver high-level technical reports and recommendations to senior management and customers, ensuring alignment with business objectives and reliability standards. **Required Experience and Skills** - BS degree in Electrical or Computer Engineering with 8+ years of relevant experience, or MS degree with 6+ years in FA and reliability engineering. - Demonstrated expertise in digital CMOS, RF device fundamentals, and advanced circuit analysis. - Proven ability to lead complex investigations and develop innovative FA methodologies. - Extensive experience with FA tools such as SEM, CSAM, X-ray CT, IR/NIR microscopy, and wet/dry etching techniques. - Strong proficiency in PCB and IC design tools and RF/parametric test equipment. - Exceptional analytical, problem-solving, and communication skills, with the ability to influence technical decisions and drive cross-functional collaboration at senior levels. - Proficiency in Microsoft Office software including Outlook, Word, Excel, and PowerPoint. - Exceptional technical depth, leadership, and collaboration across cross-functional teams to achieve reliability excellence and continuous improvement. **Desired Experience and Skills** Desirable qualifications include prior knowledge or familiarity with failure analysis tools and techniques such as SEM (Scanning Electron Microscope) and FIB (Focused Ion Beam). Experience with digital and RF test equipment and measurements is highly valued. A solid understanding of Si and GaAs wafer processes-including wet/dry etching, photolithography, dielectric deposition and etching-is important, along with proficiency in mechanical polishing and sample preparation techniques. Knowledge of IC packaging technologies, including wire-bond, flip-chip, and molding processes, is preferred. Familiarity with advanced packaging methods and emerging semiconductor materials is a plus. Candidates should demonstrate the ability to lead strategic projects, innovate analytical techniques, and guide design improvements. Strong leadership presence, with a proven track record of mentoring and influencing multidisciplinary teams, is essential. We value individuals with a great attitude, eagerness to learn, adaptability to new technical challenges, and the ability to build relationships and collaborate effectively. #LI-JR1 The typical base pay range for this role across the U.S. is currently USD $114,400 - $220,200 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.

About Skyworks Solutions

Skyworks Solutions is a semiconductor company that designs and manufactures radio frequency (RF) and microwave components and integrated circuits (ICs) for the wireless communications industry. The company's products are used in a wide range of applications, including smartphones, tablets, and other mobile devices, as well as in wireless infrastructure equipment. Skyworks Solutions was founded in 2002 and is headquartered in Irvine, California. The company has operations in North America, Europe, and Asia.
Learn more about Skyworks Solutions
Size
11,000 employees
Market Cap
$14 billion
Industry
Net Income
$1 billion
Founded
1962
5 Year Trend
+8.5%
Revenue
$3.9 billion
NASDAQ

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