Minimum qualifications:- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
- 10 years of experience in high-density consumer hardware design, printed circuit board assembly (PCBA), and design for manufacturability (DFM).
- Experience in surface mount technology (SMT) process integration, high-risk CAD layout reviews, and conducting component-level failure analysis.
Preferred qualifications:- Master's degree or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field, or equivalent practical experience.
- Advanced understanding of solder metallurgy, intermetallic compound formation, SAC305/405 properties, and low-temperature solders.
- Demonstrated industry leadership through patents, published technical papers, or active contributions to industry standards bodies.
About the jobBe part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Staff DfM/Surface Mount Technology (SMT) Engineer, you will serve as the principal technical authority for printed circuit board assembly (PCBA) design for manufacturing (DfM) across Google's entire consumer hardware portfolio including phones, watches, hearables, and more.
In this role, you will bridge the gap between product design and mass production. You will own the technical roadmap for SMT process integration, qualify next-generation component technologies, and lead high-stakes failure analysis task forces during product ramps. Operating with high technical autonomy, you will influence product design teams early in the development lifecycle and partner directly with global tier-one contract manufacturers to ensure our hardware is built reliably and efficiently at a massive scale.
Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
US: $171000 - $248000 (USD) 20% bonus target equity benefits
Learn more about benefits at Google .
Responsibilities- Define and execute long-term technology roadmaps for PCBA assembly and high-density component packaging.
- Write and maintain proprietary PCBA design guidelines for rigid and rigid-flex assemblies.
- Lead technical gatekeeping for the OK to fabricate (OK2FAB) layout approval workflow, conducting CAD layout reviews to mitigate risks.
- Serve as the principal engineering authority for high-stakes SMT defect investigations and failure analysis.
- Define engineering standards for panel array designs, routing clearances, cross-out thresholds, and process traceability.
