General Summary:Role OverviewLead the design and execution of scalable automation platforms for connectivity (WiFi/BT) build, integration, and release on Snapdragon (Android/Linux).
Own end-to-end software integration execution and drive CI/CD, automation-first workflows, and AI-assisted systems to improve release velocity, reliability, and engineering productivity.
Key ResponsibilitiesIntegration Execution & Delivery- Drive end-to-end execution of software integration for connectivity (WiFi/BT) releases
- Own build health, integration stability, and release readiness across pipelines
- Lead issue triage, debugging, and cross-team resolution to unblock releases
- Coordinate across firmware, Android, and tooling teams to ensure timely delivery
- Continuously improve integration workflows to reduce cycle time and defects
Build, Release, CI/CD & AI-Driven Engineering- Design and scale automation for build, integration, validation, and release workflows
- Architect CI/CD pipelines for continuous integration and gated releases
- Develop reusable tooling for orchestration, failure triage, and release health monitoring
- Enable AI-based debugging, regression detection, and optimization workflows
- Leverage logs and telemetry for predictive failure analysis
- Drive adoption of AI-assisted SDLC workflows
Technical Leadership- Define automation and DevOps strategy for connectivity integration
- Drive architecture decisions for next-generation integration workflows
- Mentor engineers and promote automation-first design and system-level thinking
Minimum Qualifications:• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 4+ years of Software Engineering or related work experience.
OR
Master's degree in Engineering, Information Systems, Computer Science, or related field and 3+ years of Software Engineering or related work experience.
OR
PhD in Engineering, Information Systems, Computer Science, or related field and 2+ years of Software Engineering or related work experience.
• 2+ years of work experience with Programming Language such as C, C++, Java, Python, etc.
Core Skills- Strong experience in build and release engineering
- Deep expertise in CI/CD systems and large-scale integration pipelines
- Experience with automation frameworks for build, test, and release workflows
- Strong debugging skills in complex build/integration environments
Automation & DevOps- Python/Shell programming
- CI/CD (e.g., Jenkins), automation frameworks
- Data pipelines, telemetry, and observability systems
Preferred Qualifications- AI-assisted debugging, LLM workflows
- Exposure to data pipelines / RAG (nice-to-have)
- 8+ years experience in
- Connectivity integration (WiFi/BT)
- Android/Linux systems
- Automation / CI/CD / DevOps
Pay range and Other Compensation & Benefits: $151,900.00 - $227,900.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.