Renesas Electronics America

Sr Staff Package Design Engineer

Renesas Electronics America$100K — $130K *
Tempe, AZ 85281In-Person
Aerospace & Defense
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • 5-12 years of experience in semiconductor package development, focusing on high-reliability packaging solutions.
  • Familiarity with IC assembly processes and materials specific to high-reliability standards.
  • Experience with external suppliers and internal manufacturing processes.
  • Proficient in AutoCAD and Microsoft Office Suite for design and documentation.
  • Strong communication and analytical skills for cross-functional collaboration.
  • Knowledge of relevant military standards (MIL-STD-883, MIL-PRF-38535, MIL-STD-750).

Responsibilities

  • Develop advanced packaging technologies for aerospace and high-reliability applications.
  • Define technology requirements and qualification plans for new packaging platforms.
  • Select and qualify materials and assembly processes with external partners.
  • Create detailed package drawings in collaboration with product design teams.
  • Optimize assembly processes through experimentation and data analysis.
  • Collaborate with various teams to ensure timely qualification of new packages.
  • Maintain updated knowledge on advanced packaging technologies and market trends.

Benefits

  • Opportunities for career growth in diverse technical and business roles.
  • Work on innovative products that meet global customer needs.
  • Flexible work environment with remote options and employee support systems.
Full Job Description
Job Description

Renesas is seeking a Sr. Staff Package Design Engineer to support advanced package technology development for commercial space, aerospace, and high-reliability power applications. This role will focus on hermetic, ceramic, metal, radiation-tolerant, and Class P plastic packaging solutions, working closely with product design, reliability, OSAT partners, in-house assembly teams, and key package suppliers to define, develop, qualify, and optimize package technologies for demanding high-reliability environments.

Responsibilities
  • Develop hermetic, ceramic, metal, radiation-tolerant, and Class P plastic package technologies and interconnect methods for commercial space, aerospace, and high-reliability power applications.
  • Define package technology requirements, tooling needs, process flows, and qualification plans for new and existing package platforms.
  • Benchmark, select, and qualify materials, assembly processes, and subcontractors, including OSAT partners and Renesas' in-house Palm Bay assembly site.
  • Partner with Renesas product design teams to develop detailed package drawings for hermetic and plastic packages using AutoCAD.
  • Work with OSAT partners and internal manufacturing teams to run DOE activities, optimize assembly processes, and establish process specifications.
  • Collaborate with product engineering, program management, and reliability teams to qualify new packages and processes within required project schedules.
  • Maintain technical expertise on advances in hermetic, ceramic, metal, radiation-tolerant, and Class P plastic packaging technologies.
  • Participate in packaging roadmap development, with a focus on execution, manufacturability, reliability, and long-term package strategy.


Qualifications
  • 5-12 years of relevant experience in semiconductor package development, with emphasis on hermetic, ceramic, metal, radiation-tolerant, or Class P plastic packaging.
  • Experience with semiconductor IC assembly processes, materials, package technologies, and package qualification.
  • Familiarity with high-reliability, aerospace, commercial space, or defense-related semiconductor packaging requirements.
  • Experience working with external package suppliers, OSAT partners, or internal assembly/manufacturing sites.
  • Knowledge of AutoCAD and Microsoft Office tools, including Excel, PowerPoint, and Word.
  • Strong communication, analytical, presentation, and cross-functional collaboration skills.
  • Familiarity with MIL-STD-883, MIL-PRF-38535, and MIL-STD-750 standards.

Education
  • Bachelor's, Master's, or Doctorate degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a related technical field.


Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose 'To Make Our Lives Easier.' As the industry's leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.

With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, 'To Make Our Lives Easier.'

At Renesas, you can:
  • Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
  • Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people's lives easier, safe and secure.
  • Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.

Are you ready to own your success and make your mark?

Join Renesas. Shape Your Future with Us.

Videos To Watch
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About Renesas Electronics America

Renesas Electronics America is a leading supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad range of analog and power devices, with operations spanning research, development, design and manufacturing for a wide range of applications.
Learn more about Renesas Electronics America
Size
2,000 employees
Industry

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