Blue Origin

Sr. Mechanical Engineer, RF Payloads - TeraWave

Blue Origin$145K — $203K *
Aerospace & Defense
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in Mechanical Engineering or related field
  • 8+ years of experience in mechanical design for electronic hardware systems
  • Proficiency in 3D CAD software (CATIA, SolidWorks, NX)
  • Experience with structural and thermal analyses (analytical methods, FEA)
  • Familiarity with GD&T principles and ASME Y14.5 standards

Responsibilities

  • Lead design and packaging for phased array antennas and RF payload assemblies
  • Direct thermal management strategies for high-power RF electronics
  • Perform structural and thermal analyses to validate mechanical designs
  • Conduct architecture trade studies for RF payload hardware packaging
  • Act as technical liaison between mechanical, electrical, and RF teams
  • Provide technical direction to suppliers for RF hardware production
  • Mentor junior engineers in RF payload packaging design and analysis

Benefits

  • Medical, dental, and vision insurance
  • Basic and supplemental life insurance
  • Paid parental leave
  • Short and long-term disability coverage
  • 401(k) plan with up to 5% company match
  • Stock options for regular employees
  • Paid time off of up to four weeks per year and 14 company-paid holidays
Full Job Description
Application close date:
Applications will be accepted on an ongoing basis until the requisition is closed.

About This Role:

This Mechanical Engineer IV role leads mechanical engineering efforts for RF payload hardware supporting Blue Origin's TeraWave satellite communications network, including phased array antenna structures and RF module packaging. This role acts as the technical point of contact bridging mechanical design with RF and electrical engineering teams, leading architecture trade studies, guiding supplier and manufacturing partner technical decisions, and coordinating across programs. This position also mentors junior and mid-level engineers to build mechanical packaging capability across the team.

Responsibilities include, but are not limited to:
  • Lead design and packaging of mechanical structures for phased array antennas and RF payload hardware assemblies.
  • Direct thermal management strategies for high-power RF payload electronics, ensuring compliance with performance and reliability requirements.
  • Perform structural and thermal analyses, including tolerance stack-ups, to validate RF payload mechanical designs.
  • Lead architecture trade studies to define mechanical packaging approaches for RF payload hardware across programs.
  • Serve as technical point of contact for RF payload mechanical design, coordinating closely with electrical and RF engineering teams.
  • Provide technical leadership to suppliers and manufacturing partners, ensuring producibility of RF payload mechanical hardware.
  • Coordinate mechanical engineering efforts across programs to align RF payload packaging requirements with electrical interfaces.
  • Mentor junior and mid-level mechanical engineers on RF payload packaging design and analysis practices.

Minimum Qualifications:
  • Bachelor's degree in Mechanical Engineering or a related technical field.
  • 8+ years of experience in mechanical design and packaging of complex electronic hardware systems.
  • Proficiency with 3D CAD tools, such as CATIA, SolidWorks, or NX, for assembly modeling.
  • Experience performing structural and thermal analyses using analytical methods or finite element software tools.
  • Experience applying GD&T principles and engineering drawing standards, including ASME Y14.5, in mechanical designs.

Preferred Qualifications:
  • Master's degree in Mechanical Engineering or a related technical field, supporting advanced RF hardware design.
  • Knowledge of thermal management technologies, including heat sinks and thermal interface materials, for high-power RF hardware.
  • Experience packaging RF hardware for space-qualified systems, including radiation, thermal vacuum, and vibration environments.
  • Experience mentoring junior and mid-level mechanical engineers on RF payload packaging design and development practices.
  • Familiarity with phased array antenna mechanical integration, including panel-level packaging and beamforming module thermal design.
  • Experience leading design for manufacturability and testability efforts with contract manufacturers for RF hardware production.
  • Strong written and verbal communication skills, with the ability to present technical content to cross-functional stakeholders.


Base Pay Range for:
CA applicants is $145,188.00 - $203,263.20WA applicants is $145,188.00 - $203,263.20

Other site ranges may differ

Benefits
  • Benefits include: Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with a company match of up to 5%, and an Education Support Program.
  • Stock Options for all regular employees (working at least 20 hours/week)
  • Paid Time Off: Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.
  • Dependent on role type and job level, employees may be eligible for benefits and bonuses based on the company's intent to reward individual contributions and enable them to share in the company's results, or other factors at the company's sole discretion. Bonus amounts and eligibility are not guaranteed and subject to change and cancellation. Please check with your recruiter for more details.


About Blue Origin

Blue Origin is an aerospace company that develops rockets and spacecraft for commercial and government customers. The company's products include the New Shepard suborbital vehicle and the New Glenn orbital rocket. Blue Origin was founded in 2000 by Jeff Bezos and is headquartered in Kent, Washington.
Learn more about Blue Origin
Size
3,000 employees
Industry
Founded
2000

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