Sr. Failure Analysis Engineer

Penguin Solutions

$145K — $165K *
Technical Services
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in Electrical Engineering or related field; Master's degree preferred.
  • 5+ years of experience in DRAM module burn-in, stress testing, and failure analysis.
  • Expertise in high-speed memory interfaces (DDR4, DDR5, HBM) and SI/PI concepts.
  • Strong problem-solving skills and experience in root cause failure analysis in computing environments.
  • Mastery of server memory modules and debugging in Linux and Windows.
  • Familiarity with high-frequency test equipment, especially oscilloscopes.
  • Proficient with AI tools, data analysis, and scripting languages like Python or Perl.

Responsibilities

  • Lead and execute failure analysis on DRAM modules using advanced testing tools.
  • Identify root causes of failures at chip, module, and system levels, sharing insights with teams.
  • Develop and implement system-level debug strategies related to memory interactions and configurations.
  • Analyze and mitigate performance issues due to power and signal integrity or environmental stress.
  • Create and carry out advanced stress test strategies for high-performance DRAM modules.
  • Mentor junior engineers on debugging techniques and waveform analysis best practices.
  • Prepare and present comprehensive failure analysis reports with recommendations for improvements.

Benefits

  • Medical, dental, and vision insurance coverage.
  • 401k saving plan with company contributions.
  • Paid Time Off for work-life balance.
  • Life insurance options to protect employees' families.
  • Employee Assistance Program for personal and professional challenges.
Full Job Description
Senior Failure Analysis Engineer

Overview

We are seeking a seasoned and highly skilled Senior DRAM Failure Analysis Engineer with extensive expertise in high-speed, high-capacity DRAM modules. The ideal candidate will have 5+ years of experience in DRAM module reliability testing, high-speed signal integrity analysis, and failure analysis to ensure optimal performance in mission-critical environments. This leadership role involves owning and advancing our burn-in methodologies, spearheading high-speed testing strategies, and driving system-level failure analysis to guarantee the reliability of DDR4/DDR5 based memory solutions. You will work closely with cross-functional teams to define and enhance product performance, quality, and reliability, while also mentoring junior engineers.

Responsibilities
  • Lead and conduct complex failure analysis (FA) on DRAM modules and memory subsystems, utilizing high-speed signal integrity tools and oscilloscopes.
  • Drive the determination of failure root causes at the chip, module, and system level, presenting findings to technical and leadership teams.
  • Architect and execute debug strategies for system-level failures by analyzing memory controller interactions, BIOS tuning, and DIMM register settings in server and cloud environments.
  • Investigate and resolve critical performance bottlenecks, intermittent failures, and memory errors caused by power integrity (PI), signal integrity (SI), and thermal stress.
  • Lead the development and implementation of advanced stress test strategies for high-performance DRAM modules.
  • Mentor junior engineers in best practices for high-frequency waveform analysis, signal integrity debugging, and root cause analysis.
  • Generate and present detailed reports (8D) summarizing failure analysis findings, root causes, and strategic recommendations for product and process improvements.
  • Act as a technical lead in cross-functional teams to enhance product design, quality, and manufacturability.


Qualifications
  • Bachelor's degree in Electrical Engineering or a related field; Master's degree is a plus.
  • 5+ years of experience in DRAM module burn-in, stress testing, and failure analysis.
  • Expert-level understanding of high-speed memory interfaces (DDR4, DDR5, HBM) and advanced SI/PI concepts.
  • Proven track record of complex problem-solving and root cause failure analysis in a high-performance computing environment.
  • Demonstrated mastery of server memory modules and system-level debugging in Linux and Windows environments.
  • Expertise with high-frequency test equipment such as oscilloscopes.
  • AI & Automation Fluency: Strong proficiency in applying modern generative AI tools and Agentic frameworks to real-world business problems.
  • Advanced proficiency in data analysis and scripting (e.g., Python, Perl, or similar).
  • Deep knowledge of JEDEC reliability standards, ECC error handling, and memory RAS (Reliability, Availability, and Serviceability) features.
  • Extensive experience with BIOS tuning, memory controller optimizations, and DRAM memory training algorithms.
  • Excellent communication skills with the ability to explain complex technical concepts effectively to both technical and non-technical audiences.
  • Strong interpersonal and leadership skills for mentoring and driving cross-functional team interaction.


Location

This opportunity is in Newark, California.

Travel

Willingness to travel occasionally to customer sites and industry events as needed.

Compensation & Benefits

The base pay range that the Company reasonably expects to pay for this position in California is $145,000 - $165,000; the pay ultimately offered may vary based on business considerations, including job-related knowledge, skills, experience, and education. The position is bonus-eligible, and there are medical, dental, and vision benefits available. There is a 401k saving plan and other benefits, such as Paid Time Off, Life Insurance, and an Employee Assistance Plan.

Inclusion & Belonging Statement

We are committed to creating an inclusive environment that embraces differences and fosters belonging for all.

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