SiTime Corporation

Sr. Engineer, Package Design

SiTime Corporation$138K — $190K *
Manufacturing & Automotive
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • M.S or PhD in Mechanical Engineering, Material Science, or a relevant field
  • 5+ years in semiconductor IC packaging technology and methodology
  • Proven experience managing overseas OSATs for production
  • Strong knowledge of leadframe-based, flip-chip, and substrate-based packages
  • Familiarity with flip-chip and bumping technologies
  • Understanding of thermal, stress, and electrical considerations in package design
  • Hands-on CAD software experience (AutoCAD preferred)

Responsibilities

  • Develop new packaging technology for MEMS-based timing solutions
  • Lead package design, development, and release-to-production activities
  • Manage and analyze design of experiments (DoEs) locally and overseas
  • Oversee development activities at OSATs
  • Collaborate with OSATs on prototyping and testing new package designs
  • Ensure technologies meet performance, reliability, and quality standards
  • Lead troubleshooting for package design or performance issues

Benefits

  • 401k plan
  • Comprehensive health and wellness benefits including medical, dental, and vision
  • Life insurance
  • Parental leave
  • Legal services
  • Generous time-off plans
Full Job Description
Job Summary

The Senior Semiconductor Package Engineer is responsible for the specification, design, development, and qualification of unique custom packaging technology for SiTime's revolutionary MEMS-based timing products. Packaging technologies include QFN, WLCSP, ceramic, substrate-based, and multi-chip/package modules, all of which incorporate custom-designed MEMS and CMOS components.

Responsibilities:
  • Develop new packaging technology for SiTime's MEMS-based timing solutions
  • Lead activities for package design, development, and release-to-production
  • Develop, manage, and analyze DoEs running locally and overseas
  • Manage development activities at OSATs
  • Work with OSATs to prototype and test new custom package designs
  • Ensure new technologies achieve required performance, reliability, and quality requirements
  • Lead troubleshooting activities related to package design or performance


Qualifications & Requirements:
  • M.S or PhD. Degree in Mechanical Engineering, Material Science, or other relevant field
  • 5+ years' experience in semiconductor IC packaging technology and methodology
  • Experience managing overseas OSATs to bring products into production
  • Knowledge of leadframe-based, flip-chip, and substrate-based packages
  • Experience with flip-chip and bumping technologies
  • Understanding of thermal, stress, and electrical considerations in package design
  • Hands-on experience with CAD software (AutoCAD preferred but not required)
  • The desire to work in a fast-paced, challenging, and risk-taking environment


Desired Characteristics & Attributes:
  • Understanding of thermal, mechanical, and electrical modeling for semiconductor packages
  • Understanding of material characterization techniques (DMA, TMA, TGA, etc.)


Compensation Range:

At SiTime, we believe great work deserves great rewards. We offer a comprehensive and highly competitive compensation package designed to attract top talent.

The annual base salary range for this role is $138,800.00 - $190,850.00. The final offer is determined by factors such as location, experience, education, and training.

In addition to base salary, this role is eligible for a quarterly bonus tied to the achievement of innovation goals-reflecting our commitment to recognizing meaningful impact. We also offer equity grants, providing a meaningful opportunity to share in the company's future growth and success.

Benefits offered: 401k plan, health and wellness that includes medical, dental, vision, life, parental leave, legal services, and time off plans.

Learn More about SiTime: Review the Get to Know SiTime section of our career page to explore our culture, values, and what makes us unique.
  • Innovation on Top - Philosophies of Innovation with Rajesh Vashist
  • Fabrication Knowledge - An Interview with Rajesh Vashist
  • SiTime Corporation - YouTube

#LI-SITIME

About SiTime Corporation

SiTime Corporation is a semiconductor company that designs and manufactures silicon MEMS-based timing solutions. The company's products are used in a variety of applications, including telecommunications, networking, computing, and consumer electronics. SiTime's MEMS-based timing solutions offer several advantages over traditional quartz-based solutions, including higher performance, smaller size, and lower power consumption. The company was founded in 2005 and is headquartered in Santa Clara, California.
Learn more about SiTime Corporation
Size
279 employees
Market Cap
$2 billion
Industry
Net Income
-$9.3 million
Founded
2005
Revenue
$116.1 million
NASDAQ

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