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Job Description:
The System Level Test Program Manager owns SLT program execution for multiple concurrent XPU customer programs across a distributed US-Asia footprint, balancing real-time program delivery with technical innovation. This role combines program management accountability (schedule, yield, cost), on-site production leadership (partnering with Asia test operations), and a technical engineering depth (test methodology and equipment evaluation). Success requires customer management, relentless prioritization under pressure, cross-timezone coordination, and occasional travel to Asia production sites.
Key Responsibilities
Program Management & Multi-Customer Execution
• Own end-to-end SLT execution for multiple concurrent XPU programs through silicon bring-up, production ramp, and sustained 100% volume operations
• Drive weekly program status, risk tracking, and customer commitments; escalate blockers to Senior Management within 24 hours with recommended mitigation
• Translate customer test specifications, quality gates, and margining requirements into actionable SLT plans; own electrical test coverage sign-off and escape rate targets
• Manage portfolio prioritization when programs compete for resources (equipment, site capacity, engineer time); present trade-off options and risks to director for conflict resolution
• Conduct customer program reviews, status updates, and escalation communication; own SLT portion of customer commitments
Production Operations & Asia Site Leadership
• Travel to Asia production sites couple times a year to manage test floor execution, resolve operational blockers, and ensure quality/schedule adherence
• Forecast SLT capacity requirements, drive equipment utilization optimization, and manage shift planning across US R&D and Asia production sites
• Partner with Ops manager on sustained production operations
• Establish SLT quality gates, data integrity audits, and escalation protocols for Asia production sites
• Drive equipment maintenance scheduling, spare parts inventory management, and tooling readiness to maximize SLT test floor uptime and minimize operational downtime
Test Methodology & Equipment Innovation
• Evaluate and pilot new test techniques (advanced margining, Vmin stress, multi-site protocols) in partnership with Design/DFT teams
• Lead transition of new test methodologies from R&D (US) to production (Asia); drive pilot design, runoff, and full deployment
• Influence ATE equipment roadmap and automation tooling; assess new equipment investments and ROI for SLT operations
• Mentor engineers on advanced test methodologies and drive capability growth in distributed team
• Contribute to post-silicon debug and yield correlation analysis; own SLT test-related root cause investigations
Cross-Functional Collaboration & Risk Management
• Identify, track, and prioritize risks across schedule, yield, capacity, and equipment; assess risk working with owners and target closure
• Lead root-cause analysis on yield misses, test escapes, and schedule delays; own corrective action closure and prevention planning
• Partner with Design/DFT on testability and early-silicon yield correlation; surface test bottlenecks before they cascade
• Coordinate with Manufacturing and Logistics on device staging, test scheduling, and shipment readiness
• Work with Quality/Reliability on escape analysis and early-life failure investigation
• Drive SLT yield improvement initiatives and Defective Parts Per Million (DPPM) reduction targets by partnering with test, design, and manufacturing teams to drive continuous quality enhancements
Required Qualifications
• Bachelors and 12+ years of related experience
• 9+ years in semiconductor test engineering or test operations (SLT, probe test, or production test)
• 3-5 years in program or operations leadership (with schedule, cost, or quality accountability)
• Hands-on expertise in ATE programming, test methodology, yield debugging, and SLT tool flows
• Demonstrated success shipping 2+ high-volume programs from silicon bring-up through ramp
• Experience working with cross-geographic or distributed teams; comfort with asynchronous collaboration and time zone management
• Strong project management discipline: risk tracking, escalation, forecasting, decision documentation
• Proficiency with test data analysis, yield correlation, and statistical methods
• Willingness and ability to travel internationally (Asia production sites)
• Excellent communication skills with engineers, operations teams, customers, and leadership
Preferred Qualifications
• Deep experience with XPU, high-performance computing, or networking ASICs
• Familiarity with 3nm or advanced process nodes
• Background in hyperscaler or cloud customer environments (understanding urgency and risk tolerance)
• Track record evaluating and implementing new test technologies or ATE equipment
• Experience with advanced test techniques (margining, Vmin, in-circuit stress, multi-site)
• On-site production operations or factory management experience
• Exposure to offshore team management or time zone span management
• Knowledge of test software stacks and automation frameworks
• Basic Six Sigma or process improvement certification
Compensation and Benefits
The annual base salary range for this position is USD 129,400.00 To USD 207,000.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
