Job DescriptionYou will be a Focal Plane Array Process Engineer with our Infrared Sensors Business on site in Goleta, CA. Our team is responsible for developing and manufacturing advanced Focal Plane Arrays (FPAs), and we are looking for a talented engineer to join our team.
What You Will Be DoingAs a Senior FPA Process Engineer, you will be responsible as the subject matter expert for fabrication and execution of advanced Focal Plane Array (FPA) including wicking, substrate thinning, dicing, and flip-chip bonding for hybridization, a key step in the manufacturing process imaging devices. You will play a critical role in developing and optimizing the processes, procedures, tooling, and equipment to maximize yield, efficiency, and throughput and methodologies used to precisely align and bond detector arrays and readout integrated circuits (ROICs), creating high-performance FPAs. You'll work in a fast-paced, high-mix production environment and contribute to the advancement of FPA technology.
Assignments include the definition of processing and handling equipment requirements and specifications, review of processing techniques and methods applied in the manufacture, fabrication, and evaluation of FPA devices.
Your responsibilities will include, but are not limited to:
- Work with development and process integration engineers to adapt new processes and techniques into the manufacturing line as required. This may include defining requirements for new capabilities and organizing, leading, and executing FPA processing equipment capital procurement projects.
- Responsible for projects related to process definition, fabrication, modification and evaluation of FPA devices and components.
- Analyze test data, identify trends and anomalies, and provide feedback to drive process control and improvement initiatives. Contribute to the troubleshooting and failure analysis of FPAs, identifying root causes and implementing corrective actions.
- Develop and maintain documentation, including workflows, work instructions, and process control checklists, ensuring adherence to quality standards and industry protocols.
Further Information About This Opportunity: This position is located in Santa Barbara. Discover more about our Santa Barbara, California location.
MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access.
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Basic Qualifications• Bachelors degree from an accredited college in Material Science, Engineering, Physics, or related discipline.
• 3+ years of experience in semiconductor packaging or FPA manufacturing in a cleanroom environment with demonstrated expertise in either flip-chip hybridization techniques or related processes, such as epoxy die attach/bonding, polishing, substrate removal, or Anti-Reflection (AR) coating or semiconductor packaging techniques.
• Must be a US Citizen, as this position is located at a facility that requires special access.
Desired skills• Master's Degree with 1+ year of industry experience, or PhD in Engineering, Physics, or related discipline.
• Background in IR FPA packaging, specifically flip-chip hybridization techniques.
• Knowledge of semiconductor device physics, photodetectors, and FPAs.
• Proficiency in MS Office (Word, PowerPoint, Excel).
• Excellent engineering documentation skills and communication skills.
• Ability to interface effectively from the technician level to senior management with excellent communication (written and verbal) and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and train technical staff.
• Ability to multi-task, organize and prioritize assignments independently.
• Experience in Design of Experiments (DOE), statistical process control (SPC), and data analysis software packages (e.g., JMP).
• Experience with Lean/Six Sigma methodologies and data analysis software such as MATLAB or JMP.
