Job Summary:This role will focus on developing and optimizing high-precision optical packaging processes for photonic modules, with a strong emphasis on active alignment, process development, and NPI (New Product Introduction). The ideal candidate will bring hands-on experience and technical knowledge of optical packaging or process optimization, and product reliability.
Responsibilities:- Develop, validate, and optimize active alignment processes for high-precision optical components (fiber arrays, etc.).
- Lead process development and qualification for optical module packaging.
- Support NPI efforts, including DFM (Design for Manufacturability), DFR (Design for Reliability), and transition to production.
- Design and execute experiments to characterize and optimize optical coupling efficiency, mechanical tolerances, and thermal performance.
- Drive root cause analysis of yield/reliability issues and implement robust corrective actions.
- Develop process documentation (PFMEAs, control plans, work instructions) and train technicians.
- Collaborate with external vendors and internal stakeholders to select materials, tools, and automation solutions.
- Participate in equipment selection, installation, and qualification for process scaling.
Experience/Qualifications:- Master's Degree or above in Engineering, Physics or Material Science.
- 10+ years of experience with/at semiconductor company or supplier working on PIC packaging design, qualification & multi-chip assemblies.
- 5+ years of experience working with optical fibers, optical measurements.
- 5+ years of work experience with advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly & Test) and/or EOL vendors.
- 5+ years of experience with semiconductor company or supplier working on FAU / optical connector to chip attachment.
- Experience with fiber attach tooling & process/flow development and optical data analysis.
- Experience with FA and 8D failure resolution techniques.
- Experience with developing metrics for yield and quality management, including reliability and yield based on optical and mechanical performance.
The ranges below reflect the target ranges for a new hire base salary. One is for the Bay Area (within 50 miles of HQ, Palo Alto), the second one (if applicable) is for elsewhere in the US (beyond 50 miles of HQ, Palo Alto). If there is only one range, it is for the specific location of where the position will be located. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate's qualifications including relevant education and training, competencies, experience, geographic location, and business needs. Base pay is only one part of the total compensation package. Full time roles are eligible for equity and benefits. Base pay is subject to change and may be modified in the future.
U.S. Base Pay Range
$160,000-$180,000 USD
Bay Area Pay Range
$183,000-$200,000 USD
