Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing and optimizing package architectures that support high-frequency performance, thermal efficiency, and manufacturability. The position requires close collaboration with RFIC designers, layout engineers, testing teams, and manufacturing partners to ensure successful integration of silicon, GaN, or III-V MMICs devices into production-ready packages.
Responsibilities:- Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages.
- Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools.
- Work with signal integrity, EM, and thermal simulation teams to validate package performance.
- Generate package documentation, fabrication drawings, and assembly specifications.
- Participate in design reviews, prototype builds, and failure analysis to improve RF performance and yield.
- Collaborate with RFIC designers to co-optimize chip and package performance, minimizing parasitics and signal loss.
- Support package integration with PCB design teams to ensure optimal RF performance at the system level.
- Coordinate with fabrication and assembly partners.
Requirements- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
- 3-5 years of experience designing advanced RFIC semiconductor packages up to 50GHz (e.g., wirebond, flip-chip, PoP, or SiP) using tools such as Cadence Allegro APD/SiP or Mentor Xpedition.
- Strong foundation in electrical, thermal, materials, or mechanical engineering principles relevant to IC packaging.
- Must be willing to work full-time, onsite, in Atlanta, GA.
Preferred Skills:- Familiarity with signal and power integrity analysis tools (e.g., HFSS, Q3D, PowerSI) and understanding of high-speed interface requirements such as DDR or PCIe.
- Knowledge of substrate manufacturing processes, package layout constraints, and design verification tools including CAM350, Valor, or Calibre.
- Experience with RFIC or 5G packaging design, along with scripting or automation skills (Python, TCL, Perl, or shell) to support design workflows.
- Ability to build accurate 3-D models of packages using Ansys Electronics Desktop and EM-simulate them in HFSS and run thermal simulations on them with Icepak
Benefits- Competitive Salary and Equity Package
- Comprehensive Health, Dental, and Vision Insurance
- 401(k) Retirement Plan
- Paid Time Off (PTO) and Sick Leave
