Semiconductor Packaging Engineer
MACOM Technology Solutions Holdings
•$90K — $121K *
Morrisville, NC 27560 In-Person
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Job Description
Company Overview:
MACOMdesigns and manufactures semiconductor products for Data Center,Telecommunication and Industrial and Defense applications. Headquartered inLowell, Massachusetts, MACOM has design centers and sales offices throughoutNorth America, Europe and Asia. MACOM is certified to the ISO9001 internationalquality standard and ISO14001 environmental management standard.
MACOM hasmore than 65 years of application expertise with multiple design centers, Si,GaAs and InP fabrication, manufacturing, assembly and test, and operationalfacilities throughout North America, Europe, and Asia. Go to www.macom.com toview our facilities. In addition, MACOM offers foundry services that representsa key core competency within our business.
MACOM sellsand distributes products globally via a sales channel comprised of a directfield sales force, authorized sales representatives and leading industrydistributors. Our sales team is trained across all of our products to give ourcustomers insights into our entire portfolio.
Mechanical Design Engineer (Packaging)
The packaging engineeringgroup of MACOM supports the design, development, and implementation ofpackaging solutions for RF semiconductor devices.
Key Duties:
Job Requirements:
EEO:
MACOM is anEqual Opportunity Employer committed to a diverse workforce. MACOM willnot discriminate against any worker or job applicant on the basis of race,color, religion, gender, gender identity, gender expression, national origin,ancestry, age, sexual orientation, marital or civil partnership status,pregnancy, disability, genetic information, veteran status, militaryobligations, or membership in any other category protected under applicablelaw.
Reasonable Accommodation:
MACOM iscommitted to working with and providing reasonable accommodations to qualifiedindividuals with physical and mental disabilities. If you have adisability and are in need of a reasonable accommodation with respect to anypart of the application process please call +[redacted] or emailHR_Ops[redacted] Provide your name, phone number and the position titleand location in which you are interested, and nature of accommodation needed,and we will get back to you. We also work with current employees whorequest or need reasonable accommodation in order to perform the essentialfunctions of their jobs.
MACOMdesigns and manufactures semiconductor products for Data Center,Telecommunication and Industrial and Defense applications. Headquartered inLowell, Massachusetts, MACOM has design centers and sales offices throughoutNorth America, Europe and Asia. MACOM is certified to the ISO9001 internationalquality standard and ISO14001 environmental management standard.
MACOM hasmore than 65 years of application expertise with multiple design centers, Si,GaAs and InP fabrication, manufacturing, assembly and test, and operationalfacilities throughout North America, Europe, and Asia. Go to www.macom.com toview our facilities. In addition, MACOM offers foundry services that representsa key core competency within our business.
MACOM sellsand distributes products globally via a sales channel comprised of a directfield sales force, authorized sales representatives and leading industrydistributors. Our sales team is trained across all of our products to give ourcustomers insights into our entire portfolio.
Mechanical Design Engineer (Packaging)
The packaging engineeringgroup of MACOM supports the design, development, and implementation ofpackaging solutions for RF semiconductor devices.
Key Duties:
- Create new package designs using input from RF design, manufacturing, and package suppliers.
- Generate and review assembly and outline drawings using CAD software
- Collect data directly or coordinate work with external labs, using metrology and failure analysis tools and techniques
- Design experiments and analyze results using statistical techniques and process improvement methodology
- Work with material suppliers and assembly subcontractors to understand processes and design rules to help guide new product designs
- Run thermal and mechanical simulations with FEA software packages to characterize new materials and device designs
- Create reports of work and present to other engineers and management
Job Requirements:
- BS in Mechanical Engineering, Manufacturing Engineering, Materials Science, or related discipline
- 7+ years of relevant work experience in the semiconductor industry
- Experience in semiconductor assembly processes including die attach, wire bond, lid seal, plastic overmolding, singulation, etc.
- Understanding of reliability, failure analysis, and quality controls in package development and qualification
- Excellent teamwork and good verbal and written communication skills
- Good critical thinking and problem solving skills
EEO:
MACOM is anEqual Opportunity Employer committed to a diverse workforce. MACOM willnot discriminate against any worker or job applicant on the basis of race,color, religion, gender, gender identity, gender expression, national origin,ancestry, age, sexual orientation, marital or civil partnership status,pregnancy, disability, genetic information, veteran status, militaryobligations, or membership in any other category protected under applicablelaw.
Reasonable Accommodation:
MACOM iscommitted to working with and providing reasonable accommodations to qualifiedindividuals with physical and mental disabilities. If you have adisability and are in need of a reasonable accommodation with respect to anypart of the application process please call +[redacted] or emailHR_Ops[redacted] Provide your name, phone number and the position titleand location in which you are interested, and nature of accommodation needed,and we will get back to you. We also work with current employees whorequest or need reasonable accommodation in order to perform the essentialfunctions of their jobs.