RD Manager

Foxconn Technology Group

$135K — $160K *
Telecommunications & Hardware
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor of Science (BS) in Electrical, Mechanical, Computer, or Systems Engineering or closely related field.
  • 4-7 years in high-performance server or computing hardware architecture.
  • 3+ years focusing on AI-specific power and thermal infrastructure.
  • Experience across EVT, DVT, and PVT phases with a focus on failure analysis and risk management.
  • 3-5 years in a leadership role guiding engineering teams and managing resources.

Responsibilities

  • Lead architecture and design of AI servers and rack infrastructure, focusing on power, thermal, and mechanical requirements.
  • Mentor and develop an engineering team, setting project goals and resource allocation.
  • Ensure design readiness and manage risk assessment throughout the hardware lifecycle.
  • Collaborate with teams to optimize designs for performance, cost, and manufacturability.
  • Act as the technical point of contact with customers and suppliers to ensure alignment on requirements.

Benefits

  • Opportunity to lead innovative R&D in next-gen AI infrastructure.
  • Mentorship role fostering engineering talent and expertise.
  • Collaborative environment with cross-functional teams.
  • Impact on the development of technology for hyperscale customers and Tier-1 suppliers.
Full Job Description
Job Summary:

The R&D Manager leads and mentors a highly specialized engineering team responsible for the architecture, design, development, and validation of next-generation AI server and rack infrastructure. This role provides technical leadership across high-performance hardware architecture, high-density power delivery, advanced thermal management, high-speed signal and power integrity, and full hardware lifecycle validation.

Duties and Responsibilities:

  • Lead the architecture and system-level design of next-generation AI servers and rack infrastructure, including power, thermal, mechanical, electrical, and reliability requirements. Provide technical direction on high-density power, liquid cooling, signal integrity, power integrity, and complex system-level engineering trade-offs.
  • Lead, mentor, and develop a highly specialized engineering team while establishing project priorities, milestones, and performance expectations. Allocate engineering resources effectively across multiple programs and provide technical guidance to resolve complex engineering challenges.
  • Serve as the technical gatekeeper for design readiness, risk assessment, and validation throughout the EVT, DVT, and PVT lifecycle. Drive root-cause failure analysis, corrective actions, and risk mitigation to prevent critical design issues from reaching production or customer deployment.
  • Partner with engineering, manufacturing, quality, supply chain, and NPI teams to optimize designs for performance, cost, reliability, manufacturability, and scalability. Lead the transition from R&D to manufacturing and provide technical leadership during builds, engineering changes, and production ramp.
  • Serve as a technical interface with hyperscale's, Tier-1 customers, suppliers, and technology partners to align technical requirements and validation expectations. Evaluate external technologies, resolve technical issues, and drive corrective actions to support product performance and time-to-market.


Education:

  • Bachelor of Science (BS) degree in Electrical Engineering, Mechanical Engineering, Computer Engineering, Systems Engineering, or a closely related is required.


Experience:

  • 4-7 years of experience in high-performance server, rack, or computing hardware architecture and system design, with strong knowledge of AI server/rack systems, high-density power architecture, signal integrity, and power integrity.
  • 3+ years of experience with AI-specific power and thermal infrastructure, including advanced thermodynamics, high-density power delivery, liquid cooling, and system-level thermal management.
  • 4+ years of experience across EVT, DVT, and PVT, with proven ability to perform root-cause failure analysis, manage engineering risks, and drive complex hardware issues through resolution. At least 3 years of experience implementing DFM, DFT, DFC, and other Design for X principles is preferred.
  • 3-5 years of experience leading engineering teams, mentoring technical talent, allocating resources, and managing multiple priorities. Demonstrated technical credibility, strong decision-making, and the ability to lead teams effectively under pressure are required.
  • Strong ability to influence engineering, manufacturing, NPI, quality, supply chain, vendors, and customers to achieve technical and business objectives. Experience working with hyperscalers, Tier-1 customers, or strategic technology suppliers is strongly preferred.

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