Product Development / Thermal Engineer - Liquid Cooling

Amphenol ICC

$90K — $120K *
Technical Services
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's or Master's degree in Mechanical Engineering or related field.
  • 4+ years of experience in product development, ideally with thermal management.
  • At least 3 years of experience specifically in Liquid Cooling and Computational Fluid Dynamics (CFD).
  • Strong proficiency in CAD software like SolidWorks or Creo, plus thermal simulation tools such as ANSYS or FloTHERM.
  • Proven project management skills and ability to work across various teams.
  • Excellent communication skills with experience in customer engagement.

Responsibilities

  • Architect and develop efficient liquid cooling plates for high-density applications.
  • Engineer microchannel structures and flow configurations to optimize thermal performance.
  • Select and integrate materials for maximum thermal transfer and reliability.
  • Define and execute comprehensive thermal performance testing methods.
  • Validate designs to meet industry standards and customer specifications.
  • Lead cross-functional teams through product development lifecycle.
  • Act as a technical liaison to customers, ensuring their requirements are met.

Benefits

  • On-site role in Schaumburg, IL.
  • Opportunity to work on cutting-edge AI and ML technologies.
  • Engagement with cross-functional teams and customers.
  • Chance to innovate in thermal management solutions.
Full Job Description
Job Title: Product Development / Thermal Engineer - Liquid Cooling

The position will be located on-site in Schaumburg, IL.

Position Overview

Amphenol is seeking a highly skilled and motivated Product Development Engineer to lead the design and development of liquid cooling solutions for front-end I/O connectors that will power the next generation of Artificial Intelligence (AI) and Machine Learning (ML) platforms. This role is critical to advancing thermal management technologies that support high-performance computing environments.

Key Responsibilities

Design & Development
  • Architect and develop liquid cooling plates optimized for high-density front-end I/O connector applications.
  • Engineer microchannel structures, cold plate geometries, and flow path configurations to maximize thermal efficiency and minimize pressure drop.
  • Select and integrate materials compatible with high-performance thermal transfer and long-term reliability in data center environments.
  • Collaborate with connector design teams to ensure seamless mechanical integration and manufacturability.

Testing & Validation
  • Define and execute thermal performance testing, including heat dissipation, flow rate analysis, and environmental stress testing.
  • Validate cooling plate designs against industry standards and customer-specific requirements.
  • Work with internal labs and external partners to ensure robust qualification and certification processes.

Project Management
  • Lead cross-functional development projects from concept through production.
  • Manage timelines, deliverables, and resource coordination to meet program milestones.
  • Track and report progress using structured project management tools and methodologies.

Customer Engagement
  • Serve as a technical liaison with key customers to understand requirements and deliver exceptional support.
  • Represent Amphenol's commitment to exceptional customer experience through proactive communication, technical presentations, and issue resolution.

Qualifications
  • Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or related field.
  • 4+ years of work experience in product development, preferably in thermal management or connector technologies.
  • Minimum 3 years of work experience with Liquid Cooling and CFD is required (MUST HAVE)
  • Strong proficiency in CAD tools (e.g., SolidWorks, Creo) and thermal simulation software (e.g., ANSYS, FloTHERM).
  • Proven experience in project management and cross-functional collaboration.
  • Excellent communication skills and customer-facing experience.

Preferred Skills
  • Familiarity with high-speed I/O connector standards and applications.
  • Experience in AI/ML hardware environments or data center infrastructure.
  • Knowledge of fluid dynamics, heat exchanger design, and materials used in liquid cooling systems.


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