We are seeking a Principal Vacuum Interconnect Architect - Quantum Hardware in our Broomfield, CO location to lead development of scalable interconnect architectures for our next-generation large-scale quantum computers. Future systems such as Lumos will require interconnect solutions that support orders-of-magnitude growth in qubit count, signal density, optical access, thermal performance, vacuum compatibility, and system reliability. This role is intended for a senior technical leader who can operate independently, define requirements, evaluate new technologies, guide prototype development, and make high-impact recommendations that shape the system architecture.

The ideal candidate will have deep expertise in one or more optical interconnects, electrical interconnects, advanced packaging, cryogenic systems, UHV/XHV vacuum systems, photonics, RF/electrical systems, or precision hardware for complex scientific instruments. They should be comfortable working across disciplines and translating high-level architecture goals into practical subsystem requirements, design trades, prototypes, and validation plans.

All applicants for placement in safety-sensitive positions will be required to submit a pre-employment drug test

Key Responsibilities:

• Lead the architecture and technical strategy for scalable optical and/or electrical interconnect solutions for next-generation quantum computing systems.
• Develop interconnect concepts capable of supporting million-qubit-scale system requirements, including high-channel-count connectivity, cryogenic operation, XHV compatibility, thermal constraints, signal integrity, optical performance, manufacturability, and reliability.
• Work closely with system architecture, trap fabrication, cryogenic ASIC, optics, electrical engineering, vacuum, cryogenic, mechanical, and packaging teams to define interconnect requirements and interfaces.
• Identify key technical risks and define prototype tests to retire those risks quickly and quantitatively.
• Oversee the design, fabrication, assembly, and validation of prototype interconnect hardware and subsystem demonstrators.
• Evaluate manufacturability, scalability, reliability, assembly flow, testability, and integration risk for proposed interconnect architectures.
• Mentor and develop junior engineers.
• Work closely with a small, cross-functional design team to rapidly conceptualize, validate, and deliver high-reliability designs and prototypes that solve key optical and electrical packaging challenges.
• Work with subsystem teams to identify potential technology insertions into the architecture.
• Partner with fabrication and electrical engineering teams to co-design trap-package, ASIC, and interposer-level packaging solutions.
• Communicate findings and design proposals to technical, management, and executive audiences.
• Generate and present subsystem design trade studies and analyses.

YOU MUST HAVE:

• PhD Required
• Minimum of 12 years of experience (PhD inclusive) involving one or more of the following areas: cryogenic system design, optical interconnect, electrical interconnect, vacuum systems, thermal modeling, qubits, atomic physics, spectroscopy, optics, electronics, or laboratory work in the physical sciences.
• Due to Contractual requirements, must be a U.S. Person defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status.
• Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen.

WE VALUE:

• 15+ years of experience in scientific research and development, advanced engineering, systems architecture, or technical leadership roles preferred.
• Deep expertise in optical interconnects, fiber-optic packaging, photonic interposers, optical feedthroughs, electrical feedthroughs, high-density signal routing, cryogenic interconnects, or advanced hardware packaging.
• Experience using simulation and modeling to inform design decisions, including thermal modeling, FEA, optical modeling, signal-integrity modeling, or vacuum/thermal analysis.
• Strong written and oral communication skills, including the ability to present complex trade studies and recommendations to technical and non-technical audiences.
• Demonstrated ability to lead complex technical design efforts involving multiple engineering or scientific disciplines.
• Experience designing, building, testing, or validating complex hardware prototypes.
• Ability to operate with a high degree of autonomy and technical ownership.
• Experience performing simulation and modeling to inform experiments
• Experience with control systems for data collection, signal processing, and analysis
• Experience with electrical and fiber optic feedthroughs
• Experience with extreme-high vacuum environments
• Experience with trapped ions and ion transport
• Excellent written and oral communication skills, with published results within their field of research

$162,000 - $218,863 a year

Compensation & Benefits

Incentive Eligible - Range posted is inclusive of bonus target

The pay range for this role is $162,000 - $218,000 annually. Actual compensation within this range may vary based on the candidate's skills, educational background, professional experience, and unique qualifications for the role.

Our global team of more than 800 employees includes many of the world's leading scientists, engineers, and researchers, with more than 70% of our technology team holding advanced degrees at the Master's or PhD level. Headquartered in Broomfield, Colorado, Quantinuum operatesacross the United States, United Kingdom, Germany, Japan, and Singapore.

By joining Quantinuum, you'll help shape the future of quantum computing, pushing the limits of technology, and making the impossible possible.

What's in it for you?

We believe our people are our greatest strength and offer a comprehensive rewards package that supports your professional growth, well-being, and long-term success.

• Competitive compensation and the opportunity to work on groundbreaking technology
• Flexible work arrangements that support work-life balance
• Employer-subsidized medical, dental, and vision insurance
• 401(k) retirement savings plan with company match and student loan repayment benefit
• Equity opportunities
• Generous paid time off, sick leave, and 12 paid holidays annually
• Paid parental leave
• Employee discount programs