What you Will Do:New Product Introduction (NPI)- Drive end-to-end NPI execution from first silicon through qualification, sampling, and volume production.
- Define NPI milestones, readiness criteria, and exit conditions across design, test, reliability, manufacturing, and operations.
- Work closely with silicon design, DFT, test engineering, supply chain, and operations to ensure manufacturable, testable product launches.
- Identify technical and operational risks early and lead mitigation efforts through data-driven decision making.
Reliability & Qualification- Define and execute reliability and qualification strategies for advanced-node coherent DSP ICs, including Known Good Die (KGD) qualification.
- Develop and own reliability stress plans (HTOL, HTSL, temperature cycling, ESD, latch-up, early-life failure, etc.)
- Manage external reliability lab execution, including coverage definition, scheduling, reporting, and failure analysis.
- Analyze qualification data and drive product release readiness based on measured risk and maturity.
Product Quality - Define internal product quality targets aligned with application and market requirements.
- Own quality metrics related to silicon maturity, yield stability, and manufacturing readiness.
- Drive root-cause analysis for quality or reliability excursions and lead corrective actions.
- Support customer quality discussions as needed, primarily through preparation of data and technical analysis.
Test, Sampling & Production Ramp- Lead technical engagement with foundry and OSAT partners from wafer fabrication through back-end processing and shipment.
- Define and refine production test strategies with test engineering, balancing coverage, cost, yield, and guard-banding.
- Drive engineering builds, characterization lots, and production ramps.
- Ensuring robust handoff from engineering tests flows to stable production manufacturing.
Yield Optimization & High-Volume Manufacturing- Own yield learning and yield optimization from early silicon through high-volume manufacturing
- Perform deep analysis of wafer sort, die sort, and final test data to identify yield limiters.
- Drive cross-functional corrective actions across design, process, test, and manufacturing.
- Establish yield targets, dashboards, and regular yield reviews to support sustained volume production.
What you Will Bring:- Bachelor's degree in electrical engineering or related fields. Master's degree preferred.
- 10+ years of experience in product engineering, silicon manufacturing, reliability engineering, or related IC lifecycle roles.
- Proven experience taking complex ICs from first silicon through qualification and volume manufacturing.
- Strong background in reliability qualification, stress testing, and failure analysis
- Experience with wafer-level test, Known Good Die (KGD), and production test flows.
- Demonstrated success driving yield learning and yield improvement.
- Strong analytical skills and comfort working directly with large manufacturing and test data sets.
- Excellent cross-functional collaboration skills with a bias toward technical execution
Salary Range:$150,000 - $250,000 Base Annually
The final offer will be determined based on job-related skills, experience, qualifications, and location.
