Qorvo, Inc

Principal Mechanical Design Engineer

Qorvo, Inc • $120K — $150K *
Richardson, TX 75080In-Person
Aerospace & Defense
11 - 15 years of experience
Today
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Job Overview by Ladders

Qualifications

  • BSME/MSME degree in mechanical engineering or relevant field with 12+ years experience in semiconductor packaging
  • Experience designing packaged microelectronic assemblies for defense, avionics, aerospace, or automotive industries
  • Expertise with ANSYS and SolidWorks, or similar tools
  • Advanced knowledge of microelectronic package technologies including materials and manufacturing methods
  • Familiarity with microelectronic assembly processes such as die attach and solder reflow
  • Understanding of GD&T, ANSI standards, and tolerance stack-ups
  • Strong verbal and written communication skills

Responsibilities

  • Lead the development of next-gen microelectronic packaging technology with a focus on structural analysis
  • Collaborate with IC designers, module designers, and CAD specialists to advance packaging technology
  • Conduct detailed modeling and optimization of packaging design using FEA and other simulation tools
  • Develop and execute thermal and mechanical stress measurement techniques for product validation
  • Supervise and troubleshoot manufacturing issues as they arise
  • Monitor packaging technology trends and provide insights for implementation
  • Assist external customers with application models and failure analysis

Benefits

  • Opportunity to work on cutting-edge defense and aerospace technologies
  • Cross-functional collaboration with experts in various fields
  • Engagement with the latest trends in microelectronics and packaging technology
  • Focus on professional development and skills enhancement within a specialized area
  • Involvement in high-impact projects with national security significance
Full Job Description
Qorvo is looking for an experienced Prinicipal Mechanica/Thermal Engineer to join the Defense & Aerospace product development team. The successful candidate will lead mechanical design and analysis efforts of electronics packaging for defense communications, radar and electronic warfare applications.

RESPONSIBILITIES
  • Principal level Mechanical/Thermal Engineer developing next generation microelectronic packaging technology with emphasis on structural analysis
  • Chosen candidate will work closely with select team of IC designers, module designers, process engineers, and CAD tool set specialists to develop products and development tools to move state of the art packaging technology forward
  • Using FEA and other industry standard simulations tools:
    • Perform detailed modeling and optimization of packaging design at the die/package/board level
    • Develop and execute thermal and mechanical stress measurement techniques to support analysis for internal and external customers
  • Guide package and substrate design decisions that meet performance specifications and yield requirements
  • Supervise and respond to manufacturing issues as they occur
  • Maintain view of packaging technology trends across GaN, GaAs, Digital Si, and Analog Si. Provide inputs to implement these technology trends
  • Support external customers with applications models and failure analysis support


QUALIFICATIONS:
  • BSME/MSME degree in mechanical engineering or other relevant field with a minimum of 12 years' experience in semiconductor packaging
  • Experience in the design of packaged microelectronic assemblies for the defense, avionics, aerospace, or automotive industries
  • Expert level skill with ANSYS and Solidworks, or similar
  • Expert knowledge of legacy and advanced microelectronic package technologies for commercial, defense, and aerospace markets including materials, manufacturing methods, plating, sealing, and interconnect technologies
  • Experience with microelectronic package assembly processes including die attach, wire bond, flip chip, epoxy dispense, encapsulation, and solder reflow
  • Knowledge of microelectronic inspection tools and equipment including capabilities and limitations. Similar knowledge of failure analysis techniques and equipment
  • Knowledge of reliability calculation methods for semiconductors
  • Understanding of GD&T, ANSI standards and tolerance stack-ups required
  • Demonstrated ability to work with cross-functional teams
  • Excellent verbal communication and interpersonal skills
  • Excellent written communications skills


This position is not eligible for visa sponsorship by the Company.

This position requires work on US Government contracts. Applicants must be a US Person (US citizen, permanent resident, asylee or refugee).

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About Qorvo, Inc

Qorvo, Inc is a semiconductor company that designs, manufactures, and supplies radio frequency (RF) solutions for smartphones, tablets, wireless infrastructure, defense and aerospace applications, and Internet of Things (IoT) applications. The company's products include amplifiers, filters, switches, and integrated modules that support a range of wireless communications standards. Qorvo was formed in 2015 as a result of the merger between RF Micro Devices and TriQuint Semiconductor. The company is headquartered in Greensboro, North Carolina.
Learn more about Qorvo, Inc
Size
8,900 employees
Market Cap
$9.1 billion
Industry
Manufacturing & Automotive
Net Income
$485.2 million
Founded
2013
5 Year Trend
+8.9%
Revenue
$3.7 billion
NASDAQ
QRVO
* Ladders Estimates

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