Infineon Technologies

Principal Engineer Package Concept (Module)

Infineon Technologies$156K — $215K *
Consumer Technology
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • Degree in Physics or Electronics
  • 6 years of practical experience in assembly technologies
  • Detailed knowledge of Back End processes and materials
  • Experience with SMT-related technologies
  • Familiarity with package design tools like Autocad/Cadence
  • Strong communication and presentation skills

Responsibilities

  • Define package concepts for AI power supply products
  • Validate package concepts through simulation and hardware demonstrations
  • Align new ideas with Back End development and initiate assembly projects
  • Support package development projects until product release
  • Identify new development topics for the package roadmap
  • Provide customer support for package-specific inquiries
  • Stay updated on package solutions through market analysis and competitor tracking
  • Identify business opportunities from new technologies

Benefits

  • Diverse and inclusive working environment
  • Commitment to equal employment opportunities
  • Encouragement for applicants to apply even if they don't meet all requirements
  • Support from recruiters to ensure fair interview participation
  • Opportunities for professional development and growth
Full Job Description
Your Role

Key responsibilities in your new role

  • Define package concepts for AI power supply products with focus on high-performance computing modules
  • Validate package concepts through simulation and hardware demonstrators in cooperation with Back End development, product development and system architects
  • Align new ideas and concepts with Back End development (in-house + OSAT) and initiate assembly projects
  • Follow up and support package development projects until final release of the product
  • Identify new development topics and incorporate them into the package roadmap
  • Support our customers with package specific questions
  • Stay up to date on package solutions through continuous market screening and competitor analysis
  • Identify business opportunities enabled by new technologies and concepts


Your Profile

Qualifications and skills to help you succeed

  • Technical background, e.g. Degree in Physics or Electronics
  • 6 years practical experience in assembly technologies with detailed knowledge of Back End processes and materials and their dependencies laminate design/ materials/ processes
  • Background knowledge of SMT related technologies
  • Experience with typical package design tools (e.g. Autocad/ Cadence)
  • Very good communication and presentation skills


The Wage range that the company expects to pay for a qualified candidate in the United States is:

Andover, MA Minimum of $156,900 salary per year / Maximum of $215,700 salary per year

In addition, all employees will be eligible to participate in an incentive plan.

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About Infineon Technologies

Infineon Technologies AG is a German semiconductor manufacturer that produces a wide range of products including microcontrollers, power semiconductors, and sensors. The company was founded in 1999 and is headquartered in Neubiberg, Germany. Infineon Technologies has a global presence with operations in Europe, Asia, and the Americas. The company's mission is to make life easier, safer, and greener with technology.
Learn more about Infineon Technologies
Size
53,599 employees
Industry
Founded
1999
NASDAQ

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