Principal ASIC Architect

Tensordyne

$150K — $200K *
Enterprise Technology
11 - 15 years of experience
Job Overview by Ladders

Qualifications

  • 15+ years in silicon design and planning for HPC processors (GPUs, CPUs, TPUs)
  • Deep knowledge of generative AI algorithms and hardware mapping
  • Proficient in Verilog, RTL verification, and performance modeling
  • Experience in developing architectural C-models, SystemC, or TLM
  • MS or PhD in Electrical Engineering, Computer Engineering or related discipline

Responsibilities

  • Lead architectural planning for Tensordyne AI processors with specialized compute cores
  • Propose chip design solutions and create detailed design specifications
  • Oversee design reviews and provide technical guidance to design teams
  • Evaluate new silicon IP technologies and EDA tools to enhance product design
  • Collaborate with external partners and internal teams for optimum performance

Benefits

  • Mentoring and technical leadership opportunities
  • Engagement in cutting-edge AI technology
  • High-level involvement in multi-chip silicon solution development
  • Access to collaborative work with global engineering teams
  • Chance to influence the architecture of next-gen processors
Full Job Description
The Opportunity:

In this role, you will lead all phases of ASIC architecture definition and design of Tensordyne's next-generation family of processors for generative AI inference acceleration. This is an exciting opportunity that involves high-level silicon architecture planning, hands-on design, prototyping of ASIC design concepts, mentoring, and technical leadership to deliver the high-performance multi-chip silicon solutions that are at the heart of Tensordyne's vertically integrated, generative AI inference acceleration systems for data centers.
  • What You'll Do:
  • Lead the architectural planning and definition of new Tensordyne AI processors, that consist of highly specialized floating point AI compute cores, embedded memory, embedded RISC-V CPU cores, and high speed serial communications with chip-to-chip networking fabric, HBM, and PCIe connectivity.
  • Analyze technical needs, propose chip design solutions, create detailed design specifications, lead architectural modeling and establish ASIC development milestones to ensure that the final product meets requirements related to functionality, inference performance, inference accuracy, power efficiency, programmability, debuggability and manufacturability.
  • Work closely with external engineering partners, ASIC design engineers, ASIC design verification teams, SOC physical design teams, interdisciplinary software teams, product management and executives, providing technical guidance, overseeing design reviews and mentoring where applicable.
  • Lead the evaluation of new silicon IP technologies, EDA tools and methodologies to enhance the product and improve the efficiency of our chip design process.

What You'll Bring:
  • 15+ years of hands-on experience and deep expertise in silicon design engineering and architectural planning of high performance compute (HPC) processors like GPUs, CPUs, TPUs etc., as well as HBM and high speed SerDes networking technologies for AI workloads.
  • Strong understanding of generative AI algorithms, attention mechanisms, foundation transformer models, and mapping these functions to hardware.
  • Strong Verilog programming skills, and experience with RTL verification, and performance modeling. Experience with performance analysis, debugging, and optimization is also required.
  • Track record of developing architectural C-models, SystemC, or TLM. Expert-level skills in C/C++, and scripting languages like Python or Perl for automation and modeling.
  • An MS or PhD in Electrical Engineering, Computer Engineering or related engineering discipline.

For this role, occasional travel is needed to interact with global engineering partners.

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