About the RoleLumilens is revolutionizing AI compute infrastructure with next-generation photonic interconnects, enabling massive scale-out and scale-up architectures through co-packaged optics (CPO), near-packaged optics (NPO), high-density silicon photonics, and advanced heterogeneous integration.
We're looking for a world-class Senior / Principal Power Integrity Engineer to own and drive power delivery strategies across complex 2.5D/3D packages that integrate electrical ICs, photonic ICs, chiplets, and high-bandwidth memory. You'll architect robust, low-noise, high-efficiency PDNs that support extreme power densities, tight voltage margins, and ultra-high-speed signaling-critical for powering the world's largest AI clusters without compromising performance or reliability.
Key Responsibilities- Define and implement power integrity architectures for 2.5D/3D heterogeneous integration, including chiplet-based designs, interposer/substrate scaling, on-package voltage regulation, multi-rail PDN topologies, decoupling strategies, and power-aware thermal co-design.
- Perform comprehensive full-stack power integrity analysis and optimization-from die-level IR drop and electromigration to package-level PDN impedance profiling, transient response, and system-level power delivery network (PDN) validation.
- Model, simulate, and validate power delivery solutions using industry-leading tools (e.g., Ansys SIwave, HFSS, Cadence Sigrity, Apache RedHawk, Voltus, or equivalent) across silicon, interposer, substrate, and board interfaces.
- Lead power integrity co-design with silicon design, package engineering, and photonics teams to optimize bump maps, power/ground grid layouts, TSV/RDL routing, on-die decoupling, and voltage regulator placement for minimal noise, IR drop, and EMI in CPO/NPO systems.
- Drive selection and qualification of advanced power components (VRMs, capacitors, inductors, low-loss substrates, advanced TIMs) and collaborate with foundry/OSAT partners on PDN process capabilities, manufacturability, yield, and cost.
- Develop and refine power integrity methodologies, design rules, and sign-off criteria tailored to high-performance AI accelerators, photonic transceivers, and chiplet architectures.
- Analyze and mitigate power-related reliability risks, including electromigration, thermal-induced voltage droop, power sequencing, and long-term stability under dynamic AI workloads.
- Partner with cross-functional teams (architecture, Si design, package design, system engineering, supply chain) to explore emerging technologies, influence roadmaps, generate proof-of-concepts, and protect IP that maximizes power efficiency and performance.
- Own power integrity qualification, lab validation (using high-bandwidth scopes, VNAs, spectrum analyzers), correlation to simulation, and readiness for volume production ramp.
Required Qualifications- Deep expertise in power integrity for high-performance semiconductors, with strong knowledge of PDN design principles, frequency-domain analysis, transient response, on-chip/off-chip decoupling, IR drop/EM analysis, and noise mitigation techniques.
- Proven track record leading power integrity efforts in advanced packaging environments, including 2.5D/3D integration, chiplets, silicon interposers/bridges, FOWLP, CoWoS, hybrid bonding, or similar technologies.
- Bachelor's degree in Electrical Engineering, Physics, or related field + 10+ years relevant industry experience; or Master's/PhD + 7+ years related experience.
- Hands-on proficiency with PI simulation tools (Ansys, Cadence/Sigrity, Keysight ADS, Apache/RedHawk, or equivalents) and correlation to silicon measurements.
- Strong understanding of chip-package-system interactions, high-speed signaling impacts on PDN, power-aware design for AI/HPC workloads, photonic interconnects and optical engines, and reliability failure mechanisms (e.g., EM, TDDB under high current densities).
- Demonstrated ability to lead complex, cross-functional programs across global teams, foundries, OSATs, and suppliers.
- Excellent communication, presentation, and documentation skills to influence stakeholders and drive technical alignment.
Preferred Qualifications- Experience with power integrity in silicon photonics, CPO/NPO, photonic IC/laser integration, or high-bandwidth optical interconnects for AI accelerators. DTCO for 3D IC solutions
- Prior work defining long-term PDN roadmaps and executing from concept through high-volume manufacturing in hyperscale AI or HPC environments.
- Leadership in multi-supplier or multi-company power integrity initiatives with measurable impact on performance, efficiency, or cost.
- Familiarity with signal integrity/power integrity co-optimization, high-speed SerDes, PCIe/CXL interfaces, HBM integration, or advanced memory subsystems.
- Familarity with photonic and electrical IC foundry processes (BICMOS, Advanced node CMOS...etc)
- Knowledge of board/system-level power delivery requirements and multi-physics considerations (thermal-electrical coupling).
- Ability to influence senior engineering leaders across silicon architecture, package design, systems, and supply chain.
