GlobalFoundries

PMTS, A&D Field Application Eng

GlobalFoundries$145K — $236K *
Aerospace & Defense
11 - 15 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's or Master's in electrical engineering or equivalent.
  • 15+ years in semiconductor design, tapeout, and process experience.
  • Applicant must be a U.S. citizen, lawful permanent resident, or protected individual.
  • Eligible to obtain and maintain a SECRET level U.S. Government security clearance; dual citizenship not allowed.
  • Strong knowledge of IC design flows and EDA tools applied from architectural definition to performance characterization.

Responsibilities

  • Engage with customers to comprehend their technical needs for semiconductor IC development.
  • Evaluate competitive landscape to effectively promote GF's value propositions.
  • Collaborate with internal teams to create persuasive presentations of GF technology solutions.
  • Work with account management to align technical and commercial details in proposals.
  • Identify and resolve issues to facilitate the transition from DWIN to product tapeout.
  • Advocate for improvements in GF solutions to eliminate competitive gaps.

Benefits

  • Comprehensive health insurance plans.
  • Retirement savings plans with company match.
  • Opportunities for professional development and training.
  • Flexible work environment with remote work options.
  • Paid time off and holiday leave.
Full Job Description
Summary of Role: The GlobalFoundries Field Application Eng (FAE) engages with GF's US Aerospace and Defense customers early to assess customer technical needs and identify the best GF technical solution to satisfy those needs driving the opportunity to DWIN and on towards tapeout. The FAE should understand and surmount any barriers of adoption the client may have for using GF technologies for their product development. FAE will work cross functionally with internal GF technical experts in pursuit of converting these opportunities to revenue. Essential Responsibilities: • Engage with customers to understand their technical needs towards development of their semiconductor IC products. • Assess the competitive landscape to identify and advocate winning GF value propositions. • Partner internally with GF account managers, product marketing, and technical experts in the creation of compelling, application specific presentations to describe how GF technology solutions can help those customers develop their industry winning products. • Work closely with the account management team to merge technical and commercial terms into a design winning proposal. • Identify and resolve all issues / concerns to convert the DWIN into product Tapeout. • Where competitive gaps exist, advocate internally for improved features and capabilities of GF solutions to close such gaps. Other Responsibilities: • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Required Qualifications: • Education - Bachelors or Masters degree in electrical engineering or equivalent (e.g. applied physics, etc). • Experience - Minimum 15 yrs in semiconductor design, tapeout and process. • Applicant must be a U.S. citizen, lawful permanent resident of the U.S., Or a protected individual as defined by 8 U.S.C. 1324b(a) (3)," • Must be eligible to obtain and keep a SECRET level U.S. Government security clearance and cannot have dual citizenship • Skills - Working knowledge of IC chip design flows and tools from architectural definition through performance characterization. Technical Program Management, active thinking, positive attitude, problem solving, strong responsibility and ownership, teamwork and personal communication skills are critical. • Travel - Up to 20%, primarily domestic with some international travel. • Fluency in English Language - written & verbal Preferred Qualifications: • Education - Master's or PhD in electrical engineering or equivalent. • Experience - 5 yrs in semiconductor product design at the chip or module level. • Skills - Direct experience in IC chip design flows and EDA tools from architectural definition through performance characterization. Exposure/Experience in one or more of Digital / Analog Mixed Signal/HV Power/eNVM/Millimetre Wave/Silicon Photonics IC product design highly desirable. SoC product integration/design experiences highly desirable. • Demonstrated expertise in business development within the Defense Industrial Base or related government agencies • Project management skills - i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. • Strong written and verbal communication skills. • Strong planning & organizational skills. The role you are applying for may require you to obtain a US Department of Defense Security Clearance at some time during your employment. Acceptance of this role commits to applying for such if requested. Further, the applicant consents to being asked questions about their citizenship and background to assess the likelihood of obtaining a Security Clearance. The applicant also acknowledges that GlobalFoundries can only nominate and submit an application for a Security Clearance. The granting of a Security Clearance is at the sole discretion of the U.S. Government and the Department of Defense. Expected Salary Range $145,000.00 - $236,000.00 The exact Salary will be determined based on qualifications, experience and location.

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