Job DescriptionG72 is seeking an early-to-mid-career process engineer to support PCB assembly operations. Responsibilities may include but are not limited to solder paste jet printer programming, pick-and-place system package programming, reflow process generation and optimization, component processing including gold/tin mitigation and lead-forming, rework planning and assessment, and direct collaboration with engineering staff to solve complex assembly and repair challenges.
The successful candidate will demonstrate the ability to address rapidly changing fabrication priorities while helping to ensure the highest quality and reliability of the hardware produced. Opportunities exist for candidates to go beyond daily operations support by spearheading process improvement studies and quality optimization efforts.
Minimum Requirements- 5 years of experience in an industrial or CM PCB assembly environment
- Experience with solder paste jetting system programming, operation, and troubleshooting
- Experience with SMT pick-and-place system package generation, system operation, and troubleshooting
- Experience with SMT reflow processes and recipe generation
- Experience with evaluating and dispositioning PCB assembly rework and repair situations and providing a formal assessment for further evaluation by engineering staff
- Experience and demonstrated understanding (via certifications or verified training) with the IPC J-STD-001, IPC-7711/7721, IPC-A-610 standards, especially for Class 3 hardware
Preferred Qualifications- Bachelor's degree in electrical engineering or equivalent.
- 5-10 years of experience in a high-mix, low-volume PCB assembly prototyping environment supporting complex development and fabrication efforts
- Experience using the Aegis FactoryLogix manufacturing execution system (MES) environment
- Experience with Mycronic SMT equipment including the MY700 solder paste jet printer, the MY200 and MY300 pick-and-place systems, and the Mycronic solder paste inspection (SPI) and automated optical inspection (AOI) platforms
- Experience with vapor phase soldering and the Rehm Thermal Systems Condenso XC soldering system or similar platform
- Experience with board rework and repair, including the use of ball-grid-array (BGA) rework systems such as the VJ Electronix Summit 2200i
- Experience with component modification including gold and tin mitigation as well as lead-forming of SMT devices
- Experience and demonstrated familiarity with the NASA-STD-8739 standards
Hiring Range: $100,600-$136,200
Disclaimer: MIT Lincoln Laboratory provides a typical hiring range as a good faith estimate of what we reasonably expect to offer for this position at the time of posting. The final salary offered to a selected candidate will depend on various factors, including-but not limited to-the scope and responsibilities of the role, the candidate's experience, skills and education/training, internal equity considerations and applicable legal requirements. This range reflects base salary only and does not include additional forms of compensation or benefits.At MIT Lincoln Laboratory, our exceptional career opportunities include many outstanding benefits to help you stay healthy, feel supported, and enjoy a fulfilling work-life balance. Benefits offered to employees include:
- Comprehensive health, dental, and vision plans
- MIT-funded pension
- Matching 401K
- Paid leave (including vacation, sick, parental, military, etc.)
- Tuition reimbursement and continuing education programs
- Mentorship programs
- A range of work-life balance options
- ... and much more!
Please visit our Benefits page for more information. As an employee of MIT, you can also take advantage of other voluntary benefits, discounts and perks.
Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.
Requisition ID: 43136
