Position summary
- The Packaging Development Engineer will design, develop, qualify, and optimize packaging and assembly processes for semiconductor devices and sensors (including MEMS, ICs, ASICs, discrete sensors). This role leads prototype-to-production process development, reliability qualification, supplier development, and implementation into manufacturing. The engineer will balance electrical/mechanical/thermal performance, cost, manufacturability, and reliability to support Amphenol's product roadmaps.
Key responsibilities
- Develop and qualify new package types and assembly processes and flows including die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation
- Define manufacturing process flows, tooling, materials specifications, and control plans for prototypes and high-volume production.
- Lead Design for Reliability/Manufacturing (DfX/DfM) reviews with product design, test, and manufacturing teams.
- Create and execute DOE (design of experiments) to optimize process windows and yield; analyze results using statistical tools (e.g., Minitab/JMP).
- Author and maintain process documentation: process sheets, work instructions, SPC/CPK reports, FMEA, PPAP/APQP packages (for automotive customers).
- Partner with suppliers and contract manufacturers to qualify equipment, processes, materials (epoxies, solders, plating chemistries), and subcontractor processes; perform supplier audits as needed.
- Plan and oversee reliability and environmental qualification testing (thermal cycling, HAST, temperature humidity bias, mechanical shock, vibration, solderability, thermal shock); interpret results and drive corrective actions.
- Perform and coordinate failure analysis (SEM, X-ray/CT, C-SAM, cross-sectioning) and root-cause investigations.
- Transfer processes to internal and external manufacturing sites where needed; support production ramps and troubleshoot yield/quality issues at manufacturing locations.
- Ensure compliance with industry standards and customer requirements (JEDEC, IPC, ISO 9001/AS9100/IATF 16949 as applicable), plus RoHS/REACH and other regulatory needs.
- Mentor junior engineers and technicians; present technical status to stakeholders and customers.
Required qualifications
- BS in Materials/ Electrical/Mechanical Engineering (MS preferred), 3+ years in semiconductor or sensor packaging/process development
- 2+ years of hands-on experience in semiconductor or sensor packaging, assembly process development, or failure analysis.
- Demonstrated experience with die attach, wire bonding, flip-chip, molding/encapsulation, soldering , singulation and metallization/plating processes.
- Practical knowledge of reliability test protocols and failure-analysis techniques.
- Strong statistical analysis skills and experience with DOE; comfortable using Minitab or JMP.
- Experience preparing process documentation, FMEA, control plans, and PPAP/APQP packages (especially for automotive/aerospace customers).
- Excellent written and verbal communication skills; strong cross-functional collaboration.
Preferred experience and skills
- Familiarity with SEM, X-ray/CT, C-SAM, microsectioning, and metallographic microscopy.
- Knowledge of ESD/cleanroom practices and contamination control.
- Project management experience; PMP or Six Sigma certification a plus.
- Prior experience working with suppliers across APAC/EMEA and supporting process transfer globally.
Technical tools & equipment (examples)
- Software: Minitab/JMP, Excel, Word, Powerpoint
- Lab/process tools: wire bonders, flip-chip bonders, die bonders, reflow ovens, mold presses, plasma cleaning tools, , pick-and-place, X-ray/CT, SEM, C-SAM, environmental chambers for thermal/humidity testing.
Success metrics (KPIs)
- Time-to-qualify new package/processes (target per product/project).
- First-pass yield and overall manufacturing yield improvements.
- Reliability pass rates vs. customer requirements.
- Number and criticality of customer field failures attributable to packaging/process development .
- Successful transfers to internal/external production sites within schedule and budget.
- Cost-per-unit improvements from design/process optimization.
Working conditions & travel
- Typical R&D/lab environment with occasional exposure to cleanroom and manufacturing floor.
- Global travel to supplier sites, contract manufacturers, and customer locations as needed - typically up to 10-25%
Diversity, safety & compliance
- Follow Amphenol's EHS and quality policies; contribute to a culture of safety and continuous improvement.
- Support company diversity and inclusion initiatives.
WHERE YOU WILL WORKOn-site in Fremont, CAWHY YOU SHOULD JOIN OUR TEAM- Competitive salary
- 401(k)
- Health insurance and wellness programs
- 401(k) with company match
- Professional onboarding and training opportunities
- Paid time off
- Health savings account
- Flexible spending account
- Life insurance
- Inclusive and collaborative work environment
