Job Details:Job Description: Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role you will develop and optimize cutting-edge substrate processes and equipment to enable Intel's future packaging platform technologies. Your contributions will directly impact the manufacturability and reliability of next-generation products, addressing quality, cost, yield, and productivity requirements. Collaborate with cross-functional teams to tackle complex challenges, push boundaries, and innovate within a dynamic, fast-paced environment.
The scope of this role include:
- Process equipment design, install, and qualification
- Technology pathfinding and development of multi metal plating module focusing on surface prep processes, electroless and electrolytic plating.
- The engineer will join / become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.
Other responsibilities include but are not limited to:
- Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies
- Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials / chemistry interactions
- Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity
- Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.
The ideal candidate should exhibit the following behavioral traits:
- Proven technical leadership skills: Self initiative, leadership, action-oriented by influencing, written and verbal communication skills with the ability to work independently.
- Demonstrated ability to successfully participate in a highly matrix environment managing resources and timelines, as well as proven stakeholder management.
- Flexibility in changing priorities and responsibilities to support business needs.
- Work with ambiguity in a fast paced, constantly changing product roadmap environment.
Qualifications:You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences
Minimum requirements:
- Candidate must possess a Bachelor’s degree in in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, Construction Management; or related engineering degree plus 2+ years of experience.
- Master's degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, Construction Management; or related engineering degree.
Experience listed above should a combination of the following:
- Packaging module development experience
- Experience in process equipment design, install, and qualification
- Experience defining and establishing equipment configurations, process specifications, and integrated process flow for new process technologies
Preferred qualifications:
- Plating chemistry and Electrochemistry fundamental knowledge are a plus.
- PhD degree in in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, or related engineering degree.
- Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials / chemistry interactions
- Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity
Job Type:Experienced Hire
Shift:Shift 1 (United States of America)
Primary Location: US, Arizona, Phoenix
Additional Locations:
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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