Job Details:Job Description:The Role and Impact
As a Packaging Module Development Engineer within Intel's Assembly Technology Development (ATD) team, you will be at the forefront of innovation, driving the advancement of cutting-edge semiconductor packaging technologies that power the future of computing. Your work will enable Intel's leadership across mobile, edge, and hyperscale computing platforms by developing and optimizing industry-leading package assembly solutions. This dynamic role offers the unique opportunity to collaborate with cross-disciplinary teams, innovate across materials, equipment, and processes, and scale advanced packaging platforms for high-volume manufacturing. Your contributions will directly impact quality, reliability, and manufacturability, ensuring Intel's roadmap stays ahead of the curve in delivering transformative technologies.
Key Responsibilities- Develop First Level, Second Level, and Mid-Level Interconnect (FLI, SLI, MLI), as well as thermal and surface mount technology (SMT)/printed circuit board (PCB) metrology solutions, to support Intel's advanced packaging platforms.
- Collaborate with multifunctional teams to optimize assembly processes, focusing on quality, reliability, cost, yield, productivity, and manufacturability.
- Innovate next-generation materials, equipment, and fabrication techniques to advance semiconductor packaging capabilities.
- Conduct process development and equipment characterization through statistical techniques such as Statistical Process Control (SPC) and Design of Experiments (DOE).
- Manage dynamic technical projects to meet critical product development timelines.
- Provide sustaining support for equipment performance and process health in high-volume manufacturing environments.
- Partner with suppliers and cross-organizational teams to ensure material specifications and quality requirements are met.
- Lead efforts in identifying and addressing potential package quality and reliability challenges through innovative techniques and tools.
The ideal candidate demonstrates:- Proven track record of technical leadership, strategic planning, and critical thinking in challenging environments.
- Ability to manage shifting priorities while driving impactful results.
- Strong communication, influencing, and analytical skills to collaborate across diverse teams.
Qualifications:You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience.
Minimum Qualifications- Bachelor's or BS degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related STEM field with 4+ years of relevant experience
- -OR- Master's or MS degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related STEM field with 3+ years of relevant experience
- -OR- PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related STEM field with 1+ years of relevant experience
Relevant Experience should include the following:
- Demonstrated expertise in metrology solutions for semiconductor and assembly technologies
- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE).
Preferred Qualifications- Demonstrated expertise in packaging fundamentals, quality and reliability standards, and redistribution layers (RDL) packaging.
- Experience in technology development, including delivering results for complex and time-critical technical projects.
- Familiarity with semiconductor fabrication processes, assembly technologies, and materials.
- Previous related work experience in a semiconductor foundry preferred
Job Type:Experienced Hire
Shift:Shift 1 (United States of America)
Primary Location:US, Arizona, Phoenix
Additional Locations:Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-219,550.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
