Summary of Role GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. In this role, you will collaborate with cross-functional engineering teams to support the development and manufacturing of electro-optical transceivers utilizing GF's Photonix platform and advanced 2.5D/3D packaging technologies.
The engineer will contribute to package integration, process development, reliability characterization, and data analysis activities while gaining hands-on experience in advanced semiconductor packaging technologies. This position offers an opportunity to work alongside experienced engineers and develop technical expertise in silicon photonics, assembly processes, and next-generation packaging solutions.
Essential Responsibilities include: - Support assembly process integration activities for silicon photonics and advanced packaging products.
- Assist with process development, characterization, and qualification activities for new package technologies.
- Analyze engineering and manufacturing data to identify process improvement opportunities.
- Participate in failure analysis and root cause investigations for packaging and assembly-related issues.
- Support package reliability testing and characterization activities.
- Collaborate with design, product, manufacturing, quality, and supplier teams to address technical challenges.
- Contribute to design rule development and manufacturability assessments for new products.
- Document experimental results and communicate findings through presentations and technical reports.
- Participate in continuous improvement initiatives focused on yield, quality, cost, and reliability.
Other Responsibilities - Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
- Travel up to 10% to other GlobalFoundries facilities may be necessary. HM to confirm whether this should remain in posting.
Required Qualifications - Education - Graduating with a Bachelors, Master's, or PhD degree in Materials Science Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, or a related STEM discipline from an accredited degree program. HM to confirm final education level and majors.
- Must have at least an overall 3.0 GPA and proven good academic standing.
- Basic understanding of semiconductor packaging, silicon photonics, materials science, reliability, manufacturing processes, or related technologies gained through coursework, research, internships, co-ops, or academic projects.
- Demonstrated analytical and problem-solving skills.
- Experience analyzing experimental or engineering data.
- Ability to work effectively within cross-functional teams.
- Language Fluency - English (Written & Verbal).
Preferred Qualifications - Prior related internship, co-op, research, or academic project experience in semiconductor packaging, silicon photonics, reliability engineering, failure analysis, materials characterization, thermal or mechanical simulation, or process integration.
- Familiarity with Design of Experiments (DOE) methodologies.
- Experience with statistical data analysis tools.
- Knowledge of advanced packaging technologies including flip-chip, chiplets, 2.5D, or 3D integration.
- Demonstrated prior leadership experience in the workplace, school projects, competitions, research groups, or student organizations.
- Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
- Strong written and verbal communication skills.
- Strong planning and organizational skills.
#NCGProgramUS Expected Salary Range$85,000.00 - $146,000.00
The exact Salary will be determined based on qualifications, experience and location.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at
[email protected] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
