Seeking an experienced Product Engineer (PE) to own the technical readiness, manufacturability, and lifecycle performance of advanced power modules from New Product Introduction (NPI) through high-volume production and sustaining. This role is accountable for end-to-end product execution across design, test, quality, assembly, and manufacturing to deliver performance, quality, cost, and schedule targets at scale. Key Responsibilities • Own product engineering execution for advanced power modules from NPI through high-volume production and sustaining • Own the manufacturability of advanced power modules, driving robust assembly processes across OSAT and internal manufacturing sites • Establish and enforce assembly workmanship standards, ensuring compliance with IPC-A-610 (Acceptability of Electronic Assemblies) • Drive cross-functional alignment across Design, Test, Quality, and Manufacturing to enable scalable, high-yield module production • Lead resolution of assembly-related excursions, including die attach, clip attach, solder integrity, and module-level defects • Lead product bring-up, characterization, and silicon readiness in partnership with Design, Test, and Applications teams • Define and maintain product specifications, limits, and guard-bands based on silicon behavior and manufacturing capability • Lead yield analysis, parametric trend monitoring, and root-cause investigations • Drive cost, yield, and cycle-time improvement through data-driven analysis • Own manufacturing release, qualification execution, and product change management (PCNs) • Serve as the technical escalation owner for production issues, customer returns, and corrective actions • Support critical customer engagements on product, quality, and manufacturing topics as needed • 10% travel Qualifications Education: • Bachelor's degree required in Electrical Engineering, Computer Engineering, or a related field; master's degree in a relevant engineering discipline preferred. Mechanical Engineering degree preferred, particularly for roles involving module packaging, thermomechanical behavior, and assembly optimization. Experience & Skills: • 10+ years of experience in semiconductor product engineering, manufacturing engineering, or test engineering, with demonstrated ownership from NPI through high-volume production • Strong technical depth in semiconductor power products and advanced power module manufacturing • Strong data analysis skills with the ability to interpret statistical results and drive decisions • Working knowledge of new product development, qualification, and high-volume manufacturing transfer • Strong written and verbal communication skills with customers and cross-functional teams • Proven ability to lead complex technical decisions, escalations, and execution across organizations Additional Information 10% travel https://www.youtube.com/embed/k-zs4tB6nNc