Job Details:Job Description: Module Packaging Media Engineers provide project management, media design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
The responsibilities include but are not limited to the following:
- Responsible for the thermal/mechanical/electrical design, analysis, and development of media.
- Defines overall package performance and specification and realizes technology certification through qualification plans and data collection.
- Conducts tests and research on basic materials and properties.
- Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
- Provides consultation concerning packaging problems and improvements in the packaging process.
- Responds to customer/client requests or events as they occur.
- Develops solutions to problems utilizing formal education and engineering judgment.
Qualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
Candidate must possess a bachelor’s degree in mechanical engineering or related STEM field and 4+ years of experience OR a Master’s degree in the same fields with 2+ year of experience.
Experience listed above should be a combination of the following:
Mechanical Design, CAD/Solidworks/Driveworks/RSS analysis/Geometric Dimensioning/Finite Eliminate Analysis experience. Full cycle project management experience.
Preferred Qualifications:
3+ years of experience with one or more of the following:
Material handling systems including high speed/accuracy pick-n-place, motion control and vision systems.
Fundamental science and engineering concepts in development to create a novel design solutions for high volume manufacturing process.
Stakeholder management (ex.supplier/ project management/internal partner management)
Semiconductor devices and packaging processes and technology.
Technical and analytical skills, with the knowledge of statistical design of experiments and problem-solving techniques.
Media design experience
Equipment collateral experience
Job Type:Experienced Hire
Shift:Shift 1 (United States of America)
Primary Location: US, Oregon, Hillsboro
Additional Locations:
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $99,030.00-162,500.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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