Employer: FormFactor, Inc.
Position: Micro Assembly Process Engineer
Duties: - Process and develop equipment for automatization assembly and semiconductor testing devices.
- Perform medium to complex functions associated with probe card manufacturing operations, including various aspects of process development/CPI Continuous Process Improvement, and update and create work instructions and associated operator training and certification.
- Drive systematically equipment related activities, included but not limited to: Equipment development, spare parts management, and equipment performance indicators analysis and improvement (i.e., MTTR, MTBF, MTTA) Measure System Assurance and capability improvements.
- Systematize processes by providing mainline build support for NCR dispositions and various NPI activities, and follow-up with VDF maintenance to enable overall bandwidth.
- Perform functions associated with all probe card manufacturing and operations, including direct material part flows.
- Support engineering activities by recognizing and prioritizing improvement opportunities, pioneering new ideas, and finding innovative methods to accomplish production goals.
- Modify automated assembly processes and parameters to comply with new products requirements.
- Build first article probe cards including the next processes: mechanical substrates alignment/assembly, initial set-up and verification, assurance of metrology systems and re-work procedures if required.
- Lead assembly equipment upgrades based on process quality and throughput improvements.
- Manage capacity models to establish human or equipment needs to drive product ramps and assure that team's performance is adequate to meet capacity needs.
Education Required:Bachelor's degree or foreign equivalent in Electronics Engineering, Mechanical Engineering, Manufacturing Engineering, or related field.
Experience Required: 5 years of progressive experience as Manufacturing Engineer or related occupation.
Special Requirements: - Using statistical program software to manage medium to complex analysis models in JMP and Minitab, including process data, yield analysis, and DOEs.
- Six Sigma and lean manufacturing tools and techniques.
- Surface finish manufacturing processes including grinding, polishing, and lapping with tight tolerances.
- NPI (new product introduction) processes and equipment assessment and customization.
- Micro assembly process and equipment performance CPI (continuous process improvement) to lead improvement projects.
- Using microscopes, micromanipulators, and metrology tools.
Salary: $158,018 to $204,400 per year
Worksite: 7005 Southfront Road, Livermore, CA 94551
