Qorvo is seeking an IC Substrate Development Engineer to join Qorvo's RF Packaging Center of Excellence in Greensboro, NC.
In today's rapidly evolving RF market, packaging innovation is a key strategic differentiator. In this role, you will leverage your substrate development expertise to partner with suppliers and cross-functional design teams to develop next-generation substrate technologies from concept through high-volume manufacturing.
Strong communication and collaboration skills are essential, as you will work closely with business unit design teams in a dynamic, fast-paced environment.
This is a fully onsite position that will be based in our Greensboro, NC office.
Responsibilities include:- Interface between Qorvo design community and worldwide supply base to create technology roadmaps to support future products.
- Develop, qualify, and support clean launch of new laminate PCB material sets and suppliers in line with centralized Qorvo processes and documentation standards.
- Design material and surface finish evaluations using screening tests and design of experiments to improve product attributes such as RF performance, MSL rating, lower cost, or size reduction.
- Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
- Apply problem solving skills and knowledge to solve challenges related to new technologies or improve existing supply chain capabilities.
- Travel to laminate suppliers to provide technical support for technology development, supplier qualification and problem resolution.
Required Experience:- 0-2 years of experience in PCB and/or IC substrate manufacturing
- Bachelors degree in Chemistry or an Engineering discipline
Preferred Skills:- Strong communication skills
- Familiarity across a wide range of assembly/packaging process technologies and materials such as SMT, Die Attach, Wire Bond / Flip Chip, Molding, Multi-layer laminates, etc.
- Experince with laminate/PCB manufacturing including processes such as Cu pattern plating, panel plating, via drill, surface finishes, etc.
- Knowledge of dielectric materials such as prepreg, ABF, RCC, etc.
- Recognized understanding of IPC PCB and JEDEC standards
- Familiarity in PCB design rules, manufacturing and qualification standards.
- Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g. DMAIC, 8D).
- Understanding of Design for Manufacturability and requirements needed to ramp technologies in a high volume-manufacturing environment.
- Direct experience with Cu plating and/or surface finish plating.
- Project management skills.
- Experience in mSAP laminate fabrication for RF applications.
This position is not eligible for visa sponsorship by the Company.
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